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  • ELECTRONIC COMPONENTS AND CIRCUITS  (1)
  • INSTRUMENTATION AND PHOTOGRAPHY  (1)
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  • 1
    Publication Date: 2019-06-27
    Description: Strain gage load transducer measures axial embedment stresses in resins used for encapsulation of welded electronic modules. It simulates the geometry of an actual electronic component and can be modified in size, shape, and operating temperature.
    Keywords: ELECTRONIC COMPONENTS AND CIRCUITS
    Type: MFS-13486
    Format: application/pdf
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  • 2
    Publication Date: 2019-06-28
    Description: The need for a validation technique for computational fluid dynamics (CFD) codes in STOVL applications has led to research efforts to apply infrared thermal imaging techniques to visualize gaseous flow fields. Specifically, a heated, free-jet test facility was constructed. The gaseous flow field of the jet exhaust was characterized using an infrared imaging technique in the 2 to 5.6 micron wavelength band as well as conventional pitot tube and thermocouple methods. These infrared images are compared to computer-generated images using the equations of radiative exchange based on the temperature distribution in the jet exhaust measured with the thermocouple traverses. Temperature and velocity measurement techniques, infrared imaging, and the computer model of the infrared imaging technique are presented and discussed. From the study, it is concluded that infrared imaging techniques coupled with the radiative exchange equations applied to CFD models are a valid method to qualitatively verify CFD codes used in STOVL applications.
    Keywords: INSTRUMENTATION AND PHOTOGRAPHY
    Type: AIAA PAPER 91-0675
    Format: text
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