ISSN:
0032-3888
Keywords:
Chemistry
;
Chemical Engineering
Source:
Wiley InterScience Backfile Collection 1832-2000
Topics:
Chemistry and Pharmacology
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Physics
Notes:
In the manufacture of electronic devices for integrated circuits, reducing the number of resist steps is desirable for a variety of reasons. We describe some experiments on a process aimed at reducing the number of resist and registration steps in electron beam lithography. The process involves locally varying the electron dose in an electron sensitive resist (in this case poly[methyl methacrylate]) so that the different levels of exposure can be distinguished by subsequent developing. Reliable results have been achieved with three levels: (i)Strongly exposed (resist removed after short immersion in developer).(ii)Partially exposed or “metastable” (resist removed only after prolonged immersion in developer).(iii)Unexposed.In strongly exposed regions, operations such as etching may take place while using the metastable and unexposed regions to protect the workpiece. Subsequently, the metastable region may be developed for further processing.
Additional Material:
4 Ill.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1002/pen.760140715
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