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  • 1
    Publication Date: 2012-08-25
    Description: This is the second part of an article series where the mechanical and fracture mechanical properties of medium density fiberboard (MDF) were studied. While the first part of the series focused on internal bond strength and density profiles, this article discusses the fracture mechanical properties of the core layer. Fracture properties were studied with a wedge splitting setup. The critical stress intensity factors as well as the specific fracture energies were determined. Critical stress intensity factors were calculated from maximum splitting force and two-dimensional isotropic finite elements simulations of the specimen geometry. Size and shape of micro crack zone were measured with electronic laser speckle interferometry. The process zone length was approx. 5 mm. The specific fracture energy was determined to be 45.2 ± 14.4 J/m2 and the critical stress intensity factor was 0.11 ± 0.02 MPa.
    Electronic ISSN: 1996-1944
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Published by MDPI Publishing
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  • 2
    Publication Date: 2012-06-20
    Description: Internal bond strength testing is a widely used approach for testing quality traits of wood based panels. Generally, failure of internal bond specimens is due to adhesion and/or wood failure in the specimen. It has been reported that a composite product with a large variation in the vertical density profile fails in the center part of the board which is either the middle of the core layer or the transition zone between core layer and face layer. The density in the failure zone is typically 50% lower than the maximum density in the face layers. The aim of this study was to analyze the strain distribution in a specimen under tension perpendicular to the panel plane. The results showed that a high variety of strain magnitude occurred in the specimen. The strain is either aligned with the tension direction or a tension zone is built in one of the edge zones leading to failure. Vector graphics of the specimen show the problematic test setup of internal bond strength measurement. Strain spots in the edges lead to the assumption of an uneven stress distribution due to the momentum which results from non-perfect alignment or irregularities in the test setup.
    Electronic ISSN: 1996-1944
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Published by MDPI Publishing
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  • 3
    Publication Date: 2012-11-08
    Description: This paper is the third part of a study dealing with the mechanical and fracture mechanical characterization of Medium Density Fiberboards (MDF). In the first part, an analysis of internal bond strength testing was performed and in the second part MDF was analyzed by means of the wedge splitting experiment; this part deals with the double cantilever I beam test, which is designed for measuring the fracture energy as well as stress intensity factor in Mode I. For a comparison of isotropic and orthotropic material behavior, finite element modeling was performed. In addition to the calculation of fracture energy the stress intensity factor was analyzed by means of finite elements simulation and calculation. In order to analyze strain deformations and the process zone, electronic speckle pattern interferometry measurements were performed. The results revealed an elongated process zone and lower results for KIC if compared to the wedge splitting experiment. The Gf numbers are higher compared to the wedge splitting results and can be explained by the thicker process zone formed during the crack propagation. The process zone width on its part is influenced by the stiff reinforcements and yields a similar crack surface as with the internal bond test.
    Electronic ISSN: 1996-1944
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Published by MDPI Publishing
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