Publication Date:
2018-08-08
Description:
Owning to its excellent mechanical and electrical properties of epoxy resin, epoxy resin is widely used in electronic packaging field. However, thermal conductivity of ordinary epoxy resin is only 0.2W/m·K, heat is easy to be accumulated during operation of components, the stress will increase and a series of questions (e.g. cracking of product) would be caused then. Therefore, enhancing of thermal conductivity of epoxy resin is a focal research point in electronic packaging material field. In this study, hexagonal boron nitride was used as the filler, epoxy resin was used as the matrix, the hexagonal boron nitride thermal-conductive insulating composite of different mass fraction was prepared, and the impact of different boron nitride mass fraction on performance of composite was researched. It was discovered during the research that adding of boron nitride (h-BN) filler enhanced thermal conductivity of composite effectively. When mass fraction of h-BN reached to 15%, thermal c...
Print ISSN:
1757-8981
Electronic ISSN:
1757-899X
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
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