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  • 1970-1974  (1)
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    facet.materialart.
    Unknown
    Feasibility study for the development of low temperature curing adhesives (1974)
    In:  CASI
    Details
    Publication Date: 2019-07-13
    Description: The feasibility of a new approach for the development of stable, easily handled, room temperature (293 K - 311 K) curing adhesives was studied and demonstrated. The work concentrated on a family of unsaturated amide/ester resins. Twelve candidate resins were synthesized and tested for completeness of cure at room temperature, adhesion to aluminum and titanium, shear strength, moisture resistance and heat stability. The three most promising candidate resins were selected and recommended for further development.
    Keywords: MATERIALS, NONMETALLIC
    Type: NASA-CR-132422 , TRW-22743-6009-RU-00
    Format: application/pdf
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