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  • 1
    Electronic Resource
    Electronic Resource
    Weinheim [u.a.] : Wiley-Blackwell
    Materials and Corrosion/Werkstoffe und Korrosion 32 (1981), S. 275-281 
    ISSN: 0947-5117
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Description / Table of Contents: Chemical and electrochemical reactions of iron sulfide and manganese sulfide in acid and neutral solutionsThe reactions which occur upon corrosion of massive iron sulfide and manganese specimens in perchloric acid and in neutral sodium chloride solution were elucidated by measurements of current-potential curves and by coulometric and analytical investigations on the processes. In acids the sulfides are dissolved by prevailing chemical reaction under evolution of H2S. Upon applying anodic overpotentials electrochemical reactions occur simultaneously, however, with such low velocity that the contribution to corrosion of the sulfides is insignificant. Upon applying cathodic overpotentials some hydrogen discharge is observed on iron sulfide but not on manganese sulfide.In 3% sodium chloride solution both sulfides corrode very slowly upon anodic polarization, forming elementary sulfur according to MeS = Me2+ + S + 2e- (Me = Fe or Mn). At high anodic potentials additional oxidation reactions occur in which three-valent iron and tetravalent manganese ions as well as sulfite and sulfate ions are formed.Iron sulfide and manganese sulfide inclusions can he isolated from steels only by electrochemical dissolution in neutral or weakly basic electrolytes, the potential during electrolysis must not be more positive than the corrosion potential of the sulfides.
    Notes: Durch Messen von Stromdichte-Potentialkurven und coulometrisch-analytische Untersuchungen wurden die Korrosionsreaktionen kompakter Eisensulfid- und Mangansulfidproben in Perchlorsäure, und in neutraler Natriumchlöridlösung aufgeklärt. In Säuren lösen sich beide Sulfide weitgehend chemisch unter H2S-Entwicklung. Daneben laufen bei anodischer Überspannung elektrochemische Reaktionen mit so geringer Geschwindigkeit ab, daß sie nur einen unbedeutenden Beitrag zur Korrosion des Eisensulfids und Mangansulfids liefern. Kathodisch werden am Eisensulfid Wasserstoffionen entladen. Diese Reaktion ist am Mangansulfid praktisch nicht feststellbar.In dreiprozentiger Natriumchlöridlosung korrodieren die beiden Sulfide bei anodischer Überspannung elektrochemisch sehr langsam unter Bildung elementaren Schwefels nach MeS = Me 2+ + S + 2e-(Me = Fe oder Mn). Im Bereich hoher anodischer Polarisation treten zusätzliche Oxydationsreaktionen auf, durch die dreiwertiges Eisen bzw. vierwertiges Mangan sowie Sulfit- und Sulfationen entstehen. Eisensulfid und Mangansulfid können aus Stahlen nur durch elektrochemisches Lösen der Stahlmatrix in neutralen oder schwach basischen Lösungen isoliert werden. Außerdem soll das Elektrolysepotential nicht positiver als das Ruhepotential dieser Sulfide sein.
    Additional Material: 7 Ill.
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  • 2
    Electronic Resource
    Electronic Resource
    Weinheim [u.a.] : Wiley-Blackwell
    Materials and Corrosion/Werkstoffe und Korrosion 32 (1981), S. 540-545 
    ISSN: 0947-5117
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Description / Table of Contents: Studies on the cathodic effect of iron sulfide and manganese sulfide on the corrosion of iron in a three percent sodium chloride solutionIn the galvanic element iron/sodium chloride solution/iron sulfide and in the element iron/sodium chloride solution/manganese sulfide, flushed with nitrogen or air, the sulfides become the cathode and the iron is anode. Upon short circuiting the electrodes a strong cathodic polarisation of the sulfides occurs. However, only if the iron is in contact with iron sulfide in the air-flushed sodium chloride solution the corrosion of the iron is enhanced because of considerable anodic polarisation. The corrosion of the iron electrode is increased corresponding to the increase in cathodic area.According to these results inclusions of iron sulfide or manganese sulfide act as local cathodes but cannot cause pitting corrosion of unalloyed steels in a neutral chloride solution.
    Notes: In den galvanischen Elementen Eisen/NaCl-Lösung/FeS und Eisen/NaCl-Lösung/MnS, durch die Stickstoff oder Sauerstoff strömt, stellen die Sulfide die Kathode und Eisen die Anode dar. Beim Kurzschließen der Elektroden werden die Sulfide stark kathodisch polarisiert. Das Eisen korrodiert aber lediglich im Kontakt mit Eisensulfid in belüfteter Natriumchloridlösung infolge merklicher anodischer Polarisation mit erhöhter Geschwindigkeit. Die gesteigerte Korrosion der Eisenelektrode entspricht aufgrund der reaktionsbestimmenden Sauerstoffdiffusion der Vergrößerung der kathodisch wirksamen Fläche.Nach diesen Ergebnissen können in unlegierten Stählen ausgeschiedene Eisensulfid- und Mangansulfideinschlüsse als Lokalkathoden keine Lochkorrosion in neutraler Natriumchloridlösung verursachen.
    Additional Material: 5 Ill.
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  • 3
    Electronic Resource
    Electronic Resource
    Chichester [u.a.] : Wiley-Blackwell
    Surface and Interface Analysis 3 (1981), S. 16-22 
    ISSN: 0142-2421
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Physics
    Notes: External connections to thin film hybrid integrated circuits (HICs) by solder bonding have several advantages over those bonded by solid phase or thermocompression bonding. This paper reviews these advantages and discusses the parameters necessary for high strength, reliable solder joints to thin films. Dissolution of the soluble thin film(s) into solder limits the solder reflow times. Recent work has shown that dissolution rates of thin films in solder depend primarily on the degree of thin film heat treatment prior to soldering, substrate surface texture, and the method of thin film deposition. Auger in-depth profiling data show that alloy formation and internal oxidation reduces film dissolution during solder reflow. Metallographic sectioning and chemical analysis are used to identify weak solder bond interfaces which result from intermetallic formation. Tin from the solder diffuses rapidly and reacts with soluble metals such as gold, palladium and copper to form brittle intermetallics such as AuSn4, PdSn4 and Cu6Sn5. Intermetallic formation between the solder and the thin film systems of interest can affect joint strength and reliability.
    Additional Material: 16 Ill.
    Type of Medium: Electronic Resource
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