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  • 1
    Electronic Resource
    Electronic Resource
    A simple procedure for estimating virial coefficients from burnett PVT data (1988)
    Hoboken, NJ : Wiley-Blackwell
    AIChE Journal 34 (1988), S. 1229-1232 
    Details
    ISSN: 0001-1541
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Process Engineering, Biotechnology, Nutrition Technology
    Additional Material: 1 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/aic.690340722
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  • 2
    Electronic Resource
    Electronic Resource
    Correction. Molecular mechanics parameters for organosilicon compounds calculated from ab initio computations (1989)
    New York, NY [u.a.] : Wiley-Blackwell
    Journal of Computational Chemistry 10 (1989), S. 136-136 
    Details
    ISSN: 0192-8651
    Keywords: Computational Chemistry and Molecular Modeling ; Biochemistry
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Computer Science
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/jcc.540100114
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  • 3
    Electronic Resource
    Electronic Resource
    What is quality? (1988)
    Brookfield, Conn. : Wiley-Blackwell
    Journal of Vinyl and Additive Technology 10 (1988), S. 1-2 
    Details
    ISSN: 0193-7197
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Process Engineering, Biotechnology, Nutrition Technology
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/vnl.730100102
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  • 4
    Electronic Resource
    Electronic Resource
    Insect biology in depth. Insect Untrastructure, vols. 1 and 2. Edited by R. C. KING and H. AKAI. Plenum Press, 1982 and 1984. Pp. 485 and 624. $55 (vol. 2) (1985)
    New York, NY : Wiley-Blackwell
    BioEssays 2 (1985), S. 283-283 
    Details
    ISSN: 0265-9247
    Keywords: Life and Medical Sciences ; Cell & Developmental Biology
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Biology , Medicine
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/bies.950020613
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  • 5
    Electronic Resource
    Electronic Resource
    Ab initio calculations on the effect of polarization functions on disiloxane (1987)
    New York, NY [u.a.] : Wiley-Blackwell
    Journal of Computational Chemistry 8 (1987), S. 84-93 
    Details
    ISSN: 0192-8651
    Keywords: Computational Chemistry and Molecular Modeling ; Biochemistry
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Computer Science
    Notes: The effect of polarization functions for ab initio molecular orbital calculations at the 3-21G* level has been studied for disiloxane. Calculated molecular geometry, dipole moment, and the linearization barrier variation were analyzed for different uncontracted polarization functions. It was concluded that variation of the polarization function on oxygen has only a minor influence on the molecular properties of disiloxane, but its presence is required to obtain a bent geometry for the disiloxane bond. The calculated molecular properties of disiloxane are greatly influenced when the polarization function on silicon is varied. Two different values (0.3 and 0.9) for the exponent of the silicon polarization function provide results comparable to the experimental values for disiloxane. The only significant differences between the results obtained from ab initio calculations using the two polarization functions are in net atomic charges. The uncontracted polarization function of silicon with a value of 0.3 for its exponent is transferable to other organosilicon compounds. Calculated molecular geometries of flexible or rigid structures are in very good agreement with the experimental values.
    Additional Material: 10 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/jcc.540080111
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  • 6
    Electronic Resource
    Electronic Resource
    Injection molding PVC (1987)
    Brookfield, Conn. : Wiley-Blackwell
    Journal of Vinyl and Additive Technology 9 (1987), S. 2-9 
    Details
    ISSN: 0193-7197
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Process Engineering, Biotechnology, Nutrition Technology
    Notes: Injection molding rigid PVC is no longer the chore it once was. Advances in resin properties, additive systems, and molding equipment have allowed injection molders to take advantage of PVC's favorable economic, weatherability, flame retardant, and chemical resistant properties. As a result, injection molding of PVC is entering a new era. With the proper equipment and formulations, today's PVC molder is graduating from pipe fittings to ever more profitable, yet demanding, parts and applications.
    Additional Material: 8 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/vnl.730090103
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  • 7
    Electronic Resource
    Electronic Resource
    Molecular mechanics parameters for organosilicon compounds calculated from ab initio computations (1988)
    New York, NY [u.a.] : Wiley-Blackwell
    Journal of Computational Chemistry 9 (1988), S. 25-39 
    Details
    ISSN: 0192-8651
    Keywords: Computational Chemistry and Molecular Modeling ; Biochemistry
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Computer Science
    Notes: Molecular structures of 26 organosilicon compounds have been optimized using ab initio calculations at the 3-21G* (modified) level. From these optimized structures, the internal coordinates have been deformed and the variation of the total molecular energy has been studied. Parameters for stretching and bending deformations are reported herein. The bending potential for the Si—O—Si bond which has an unusual flexibility is also included. Nonbonding interactions are described in terms of steric and electrostatic potentials. For systems which do not include bond resonance effects, torsional behavior is well described by steric potentials with van der Waals radii 20% larger than the previous values and simple electrostatic potential (monopole-monopole) with net atomic charges obtained from ab initio or Extended Huckel Theory calculations. The nonbonding potentials, as defined in this study, have an advantage in that they allow for the computation of torsional barriers without torsional potentials, in the case of single bonds where no additional electronic effects interfere. As an example, it is shown that no torsional potentials are necessary to estimate the torsional barriers in the case of ethane. The newly defined potentials are used to study the torsional barrier in hexamethyldisiloxane and the conformation of octamethylcyclotetrasiloxane (D4). The most stable calculated conformation of D4, coincides with the experimentally determined structure. This study shows that the most stable conformation is determined by the steric repulsion of methyl groups.
    Additional Material: 14 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/jcc.540090105
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  • 8
    Electronic Resource
    Electronic Resource
    Dielectric studies of the cure of epoxy matrix systems (1986)
    New York, NY [u.a.] : Wiley-Blackwell
    Journal of Applied Polymer Science 31 (1986), S. 1155-1167 
    Details
    ISSN: 0021-8995
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Dielectric spectroscopy was used to monitor the curing process of two epoxy resin systems. The basic system (system I) consisted of DGEBA (a difunctional epoxy) and a polyamide in a 50-phr mixture. In addition, a comparative analysis was performed on a high-performance resin system (system II) used primarily in unidirectional composite applications. This system contained TGDDM (a tetrafunctional epoxy) and DDS (a tetrafunctional amine) in a 25-phr mixture. The dielectric data were obtained using a simple yet functional sample cell electrode designed and constructed in the laboratory. For system I, isothermal dielectric data were used to determine apparent activation energies for the temperature range from 22 to 70°C. The data showed that the activation energy was a function of temperature and increased as the temperature of the cure increased. This indicated that the reaction mechanism was also a function of temperature. For system II, data were collected between 140 and 190°C and an overall activation energy for that temperature range was determined. The overall activation energies for both systems, calculated using dielectric spectroscopy, compared favorably to those obtained using differential scanning calorimetry. Also, using a wider frequency range (240 Hz to 2 MHz), Argand diagrams were constructed and modeled with the Cole-Cole empirical equation for systems with a distribution of relaxation times. This justified the calculation of average relaxation times, which could then be related to the bulk physical properties of the polymer, such as viscosity. Modified Argand diagrams, where ε″ is plotted against ε′ at one frequency as a function of time, were also constructed, which aided in the understanding of the curing processes for these thermosetting systems.
    Additional Material: 9 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/app.1986.070310501
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  • 9
    Electronic Resource
    Electronic Resource
    Dielectric modeling of the curing process (1986)
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 26 (1986), S. 346-353 
    Details
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Dielectric data from an epoxy resin system were used as the foundation for dielectric modeling of the curing process. This resin system (DGEBA-polyamide) was chosen as an easily processible model system. Dielectric average relaxation times, defined as the reciprocal of the angular frequency at which the loss component of the dielectric constant reaches a maximum, were determined for a 40°C isothermal cure. The changes in the average relaxation time through the cure exhibited similar behavior to those for viscosity, which inspired the correlation of the two properties. The dielectric relaxation time was modeled using a six-parameter model analogous to that used for viscosity. The model parameters were in turn associated with both intrinsic properties of the system and reaction kinetics describing the cure. The possibility of extending the relaxation time model for use with single-frequency data by means of a time-frequency correlation was also investigated. Combined, these two modeling methodologies provide a powerful constitutive approach for describing dielectric properties of thermosetting polymers during cure.
    Additional Material: 7 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/pen.760260504
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  • 10
    Electronic Resource
    Electronic Resource
    Evaluation of dielectric cure models for an epoxy-amine resin system (1989)
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 29 (1989), S. 339-346 
    Details
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: The parallel-plate test fixture on a Rheometrics viscometer was electrically isolated so that the rheological and dielectric properties of a thermoset polymer system could be simultaneously measured. This enabled the relationship between the dielectric properties and the rheological properties to be directly examined. A close relationship was established between the dielectric properties (dipole relaxation time and specific conductivity) and the pre-gelation bulk viscosity. This relationship suggested that models similar in form to those used to describe the change in viscosity might be used to describe the changing dielectric properties. The limitations and advantages of two such models, which attempt to describe the time-temperature behavior of the dielectric properties, were then tested for use with a typical aerospace epoxy resin system.
    Additional Material: 8 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/pen.760290513
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