ISSN:
1572-8838
Source:
Springer Online Journal Archives 1860-2000
Topics:
Chemistry and Pharmacology
,
Electrical Engineering, Measurement and Control Technology
Notes:
Abstract An X-ray diffraction and thermal wave study of the microstructural and thermal parameters of electrodeposited copper layers was carried out. The effect of the deposition temperature on the growth and recrystallization textures as well as on the thermal diffusivity (resistivity) of copper layers was investigated. The kinetics of primary recrystallization and of stored energy release has been estimated from the orientation density and thermal resistivity data, respectively. The behaviour of the kinetic curves is discussed in relation to the heterogeneous stored energy distribution in the material.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1007/BF01077550
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