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  • 1995-1999  (7)
  • 1
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    Evaluation of the In-Service Performance Behavior of Honeycomb Composite Sandwich Structures (1999)
    Springer
    Details
    Publication Date: 1999-12-01
    Print ISSN: 1059-9495
    Electronic ISSN: 1544-1024
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Published by Springer
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    PAPER CURRENT
  • 2
    Electronic Resource
    Electronic Resource
    Thermal and mechanical characterization of high performance epoxy systems with extended cure times (1996)
    Springer
    Journal of thermal analysis and calorimetry 46 (1996), S. 1511-1525 
    Details
    ISSN: 1572-8943
    Keywords: characterization ; epoxy ; extended cure time
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology
    Notes: Abstract Five epoxy resins of different chemistry and functionality were cured with DDS (4,4′-diaminodiphenyl sulfone) using 2, 8 and 14 h curecycles. Both Differential Scanning Calorimetry (DSC) and Thermomechanical Analysis (TMA) were used to characterize reaction behavior and cured properties of the resin systems. In addition, static mechanical tests and density measurements were integrated with the thermal characterization methods to correlate resin properties with process time. Flexural three-point bending experiments showed that the resins tended to have higher yield stress and toughness values at extended cure times. The improved mechanical properties could be attributed to the full development of the epoxy molecular structure, in the form of cross-linked networks and molecular rearrangement. These results suggest that extended cure times or high temperature post-curing may be required to obtain the resin's ultimate mechanical properties for high performance composites.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01980758
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    Paper (German National Licenses)
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  • 3
    Electronic Resource
    Electronic Resource
    Temperature-Modulated Differential Scanning Calorimetry through Heat Diffusion Analysis (1998)
    Springer
    Journal of thermal analysis and calorimetry 54 (1998), S. 501-519 
    Details
    ISSN: 1572-8943
    Keywords: complex heat capacity ; heat transfer ; phase lag ; TMDSC
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology
    Notes: Abstract In the present study, a complete model of thermal diffusion in a TMDSC specimen is presented. The governing equation takes into account thermal conductivity and does not neglect temperature gradients. This model is solved analytically for a specimen of cylindrical geometry with two surfaces following the block temperature and considering the third surface insulated. The full analytical solution consists of a transient and an asymptotic expression. The asymptotic expression is divided into an underlying and a cyclic part to allow comparison with existing models. The present model finds that the phase angle between the temperatures of sample and block are dependent upon the sample material, which has not been predicted by existing models. Moreover, the present model does not require the use of an experimentally determined constant as long as the cell is ideal. It was found that the phase lag between sample and block temperatures could be described by two effective thermal diffusivities, Λ′ and Λ″, instead of complex heat capacities $$c'_p {\text{ and }}c''_{\text{p}} $$ and $$c'_p {\text{ and }}c''_{\text{p}} $$ . These heat capacity parameters were viewed as mathematical artifacts arising from the use of an over-simplified governing equation that does not take into account thermal conductivity and thermal gradients within the specimen.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1023/A:1010134307537
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    Paper (German National Licenses)
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  • 4
    Electronic Resource
    Electronic Resource
    Gas permeation and viscoelastic deformation of prepregs in composite manufacturing processes (1995)
    Brookfield, Conn. : Wiley-Blackwell
    Polymer Composites 16 (1995), S. 370-377 
    Details
    ISSN: 0272-8397
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Gas permeation and creep deformation of a commercial prepreg, which exhibits viscoelastic characteristics, were investigated as a function of time, temperature, and consolidation pressure. Experiments using a prepreg stack demonstrated that the material exhibited a linear viscoelastic bulk deformation under vacuum/autoclave pressure and furthermore, the in-plane gas flow exhibited non-Darcian flow behavior with a permeation hysteresis. This behavior was viewed and analyzed by two viscoelastic relaxation processes: (1) bulk dimensional relaxation, and (2) microscopic pore structure rearrangement. A modified standard linear solid (SLS) viscoelastic model was used to interpret the creep compliance and dynamic gas permeability utilizing two independent relaxation parameters. By visual investigation of pore sizes and their distribution, air permeation was found to take place mostly through the interlaminar porosity network for the prepreg system examined.
    Additional Material: 8 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/pc.750160505
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  • 5
    Electronic Resource
    Electronic Resource
    Microhardness of carbon fiber reinforced epoxy and thermoplastic polyimide composites (1995)
    Brookfield, Conn. : Wiley-Blackwell
    Polymer Composites 16 (1995), S. 424-428 
    Details
    ISSN: 0272-8397
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: We have examined the micro indentation hardness of a series of carbon fiber reinforced epoxy and thermoplastic polyimide (TPI) composites. In the epoxy systems, the influence of Nylon particles was studied. The effect of crystallization of the thermoplastic polyimide upon the microhardness values of the resin was also investigated. The microstructure of the TPI-composites was characterized by X-ray diffraction. The results show that the addition of carbon fibers to the neat resins greatly increases the microhardness and thus the yield stress of the composite. The value of the microhardness technique is highlighted in emphasizing the heterogeneity of the CFRC.
    Additional Material: 3 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/pc.750160512
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  • 6
    Electronic Resource
    Electronic Resource
    Anisotropy of electrical conductivity and structure in polymer-carbon fiber composite materials (1995)
    Brookfield, Conn. : Wiley-Blackwell
    Polymer Composites 16 (1995), S. 109-113 
    Details
    ISSN: 0272-8397
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Electrical conductivity for polyether and polyimide-carbon fiber composites was measured using different fiber types. The microstructure was characterized by X-ray diffraction methods. D.C. conductivity measurements were carried out in directions perpendicular, parallel, and at varying angles to the fiber axis. The influence of the distance between electrodes on the conductivity was examined. The dependence of the frequency and the temperature upon conductivity has been, likewise, investigated. Experimental results support the concept of a conduction mechanism in the composites occurring in the carbon fibers, which built up a highly interconnected conducting network. It is also shown that the high degree of fiber orientation is consistent with the conspicuous anisotropic behavior of the electrical conductivity.
    Additional Material: 8 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/pc.750160202
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  • 7
    Electronic Resource
    Electronic Resource
    Absorption of water in polyimide resins and composites (1995)
    New York, NY [u.a.] : Wiley-Blackwell
    Journal of Applied Polymer Science 57 (1995), S. 133-137 
    Details
    ISSN: 0021-8995
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: The effect of temperature, postcure, and fiber orientation on water absorption were examined for Kerimid® 723 bismaleimide resin. The effect of fiber orientation was also examined for Avimid® N and BASF X-5260. Water absorption in Kerimid® 723 was found to have an Arrhenius temperature dependence, depend on degree of postcure, and be independent of fiber orientation. BASF X-5260 water absorption was also found to be independent of fiber orientation. Avimid® N water absorption exhibited a strong dependence on fiber orientation. © 1995 John Wiley & Sons, Inc.
    Additional Material: 6 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/app.1995.070570202
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