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  • 1995-1999  (4)
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Publisher
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Year
  • 1
    Electronic Resource
    Electronic Resource
    Springer
    Fresenius' Zeitschrift für analytische Chemie 353 (1995), S. 227-233 
    ISSN: 1618-2650
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology
    Notes: Abstract The contribution given by surface analysis to solve some problems encountered in the production of electronic power devices have been discussed. Mainly two types of problems have been faced. One of these deal with interfacial chemistry. Three examples have been investigated. The first applies to the improvement of the quality and the reliability of plastic packages through the optimization of the resin/metal and resin/die adhesion. The second relies to the adhesion between polyimide and silicon nitride used in the multilevel technology. The third example refers to the so called die-attach process and related problems. Another area of interest in microelectronics is that of the erosion of various types of surfaces and the possibility of wrong etching. A few examples of the application of surface analytical techniques for these problems will be presented. XPS and SIMS working in imaging and multipoint analysis mode, scanning acoustic microscopy, contact angle measurements as well as peeling and tensile strength measurements are the main tools used to obtain useful data.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Springer
    Fresenius' Zeitschrift für analytische Chemie 353 (1995), S. 227-233 
    ISSN: 1618-2650
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology
    Notes: Abstract The contribution given by surface analysis to solve some problems encountered in the production of electronic power devices have been discussed. Mainly two types of problems have been faced. One of these deal with interfacial chemistry. Three examples have been investigated. The first applies to the improvement of the quality and the reliability of plastic packages through the optimization of the resin/metal and resin/die adhesion. The second relies to the adhesion between polyimide and silicon nitride used in the multilevel technology. The third example refers to the so called die-attach process and related problems. Another area of interest in microelectronics is that of the erosion of various types of surfaces and the possibility of wrong etching. A few examples of the application of surface analytical techniques for these problems will be presented. XPS and SIMS working in imaging and multipoint analysis mode, scanning acoustic microscopy, contact angle measurements as well as peeling and tensile strength measurements are the main tools used to obtain useful data.
    Type of Medium: Electronic Resource
    Location Call Number Expected Availability
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  • 3
    Publication Date: 1995-01-01
    Print ISSN: 0937-0633
    Electronic ISSN: 1432-1130
    Topics: Chemistry and Pharmacology
    Published by Springer
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  • 4
    Publication Date: 1995-10-01
    Print ISSN: 1618-2642
    Electronic ISSN: 1618-2650
    Topics: Chemistry and Pharmacology
    Published by Springer
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