ISSN:
1662-9752
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
The objective of this research is to investigate the solder joint reliability of board-level droptest based on the support excitation scheme incorporated with the submodel technique for stacked-diepackages. Three lead-free materials, SAC405 (Sn4Ag0.5Cu), SAC355(Sn3.5Ag0.5Cu) and Sn3.5Agwere used to demonstrate the transient dynamic response for solder balls subject to JEDECpulse-controlled board-level drop test standard. In order to evaluate the structure of the interestedarea, a strip model sliced from the full test vehicle is used in this research. In addition, the submodelregion is particularly chosen with strip model by performing the cut boundary interpolation. Theenvelope of equivalent stress for the outermost solder joint off the end of the strip model is plot toshow the potential failure mode and mechanism. The cut boundary of submodel is verified and themesh density of submodel is examined. For a refinery mesh of submodel, parametric studies forstructure and material are carried out to investigate the reliability of the outermost solder joint, and theresults are summarized as design rules for the development of stacked-die packages
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/19/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.594.169.pdf
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