ALBERT

Description: Laser beams emitted from the Geoscience Laser Altimeter System (GLAS), as well as other space-borne laser instruments, can only penetrate clouds to a limit of a few optical depths. As a result, only optical depths of thinner clouds (〈 about 3 for GLAS) are retrieved from the reflected lidar signal. This paper presents a comprehensive study of possible retrievals of optical depth of thick clouds using solar background light and treating GLAS as a solar radiometer. To do so we first calibrate the reflected solar radiation received by the photon-counting detectors of GLAS' 532 nm channel, which is the primary channel for atmospheric products. The solar background radiation is regarded as a noise to be subtracted in the retrieval process of the lidar products. However, once calibrated, it becomes a signal that can be used in studying the properties of optically thick clouds. In this paper, three calibration methods are presented: (I) calibration with coincident airborne and GLAS observations; (2) calibration with coincident Geostationary Operational Environmental Satellite (GOES) and GLAS observations of deep convective clouds; (3) calibration from the first principles using optical depth of thin water clouds over ocean retrieved by GLAS active remote sensing. Results from the three methods agree well with each other. Cloud optical depth (COD) is retrieved from the calibrated solar background signal using a one-channel retrieval. Comparison with COD retrieved from GOES during GLAS overpasses shows that the average difference between the two retrievals is 24%. As an example, the COD values retrieved from GLAS solar background are illustrated for a marine stratocumulus cloud field that is too thick to be penetrated by the GLAS laser. Based on this study, optical depths for thick clouds will be provided as a supplementary product to the existing operational GLAS cloud products in future GLAS data releases.

Description: This presentation discusses fractured leads on field-programmable gate array (FPGA) during flight vibration. Actions taken to determine root cause and resolution of the failure include finite element analysis (FEA) and vibration testing and scanning electron microscopy (with X-ray microanalysis) and energy dispersive spectrometry (SEM/EDS) failure assessment. Bonding methods for surface mount parts is assessed, including critical analysis and assessment of random fatigue damage. Regarding ceramic quad flat pack (CQFP) lead fracture, after disassembling the attitude control electronics (ACE) configuration, photographs showed six leads cracked on FPGA RTSX72SU-1 CQ208B package located on the RWIC card. An identical package (FPGA RTSX32SU-1 CQ208B) mounted on the RWIC did not results in cracked pins due to vibration. FPGA lead failure theories include workmanship issues in the lead-forming, material defect in the leads of the FPGA packages, and the insecure mounting of the board in the card guides, among other theories. Studies were conducted using simple calculations to determine the response and fatigue life of the package. Shorter packages exhibited more response when loaded by out-of-plane displacement of PCB while taller packages exhibit more response when loaded by in-plane acceleration of PCB. Additionally, under-fill did not contribute to reducing stress in leads due to out-of-plane PCB loading or from component twisting, as much as corner bonding. The combination of corner bond and under-fill is best to address mechanical and thermal S/C environment. Test results of bonded parts showed reduced (dampened) amplitude and slightly shifted peaks at the un-bonded natural frequency and an additional response at the bonded frequency. Stress due to PCBB out-of-plane loading was decreased on in the corners when only a corner bond was used. Future work may address CQFP fatigue assessment, including the investigation of discrepancy in predicted fatigue damage, as well as comparing fatigue life and fatigue damage cycle ration computed using FEA and Miner's rule to results from a fatigue assessment software program.

Description: Space Solar Power (SSP), combined with Wireless Power Transmission (WPT), offers the far-term potential to solve major energy problems on Earth. In the long term, we aspire to beam energy to Earth from geostationary Earth orbit (GEO), or even further distances in space. In the near term, we can beam power over more moderate distances, but still stretch the limits of today s technology. In recent studies, a 100 kWe-class "Power Plug" Satellite and a 10 kWe-class Lunar Polar Solar Power outpost have been considered as the first steps in using these WPT options for SSP. Our current assessments include consideration of orbits, wavelengths, and structural designs to meet commercial, civilian government, and military needs. Notional transmitter and receiver sizes are considered for use in supplying 5 to 40 MW of power. In the longer term, lunar or asteroidal material can be used. By using SSP and WPT technology for near-term missions, we gain experience needed for sound decisions in designing and developing larger systems to send power from space to Earth.