ISSN:
1662-9779
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Physics
Notes:
With the continuous shrinkage of critical sizes in semiconductor manufacturing, nano-particlessmaller than 100-nm are becoming a potential threat to devices in chips. Storage of waferscontaminated during process steps often results in a decrease of particle removal efficiency insubsequent clean, a phenomenon referred to as aging. In this work, the influence of aging on theremoval of silica and silicon nitride nano-particles from hydrophilic Si wafers was studied fordifferent storage conditions. Trends observed for aging as a function of particle size and fordifferent tools indicated that aging will become an issue for critical cleans where substrate etchingmust be kept very low and the physical component of the clean must be decreased to preventdamage to fine structures. Controlling the relative humidity during storage helped in lowering theeffect of aging
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/24/transtech_doi~10.4028%252Fwww.scientific.net%252FSSP.134.155.pdf
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