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  • 1
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Advanced materials research Vol. 53-54 (July 2008), p. 173-178 
    ISSN: 1662-8985
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: This work aims to obtain fine surface of silicon wafer during precision and ultra precisionmachining, and presents a new method called semibonded abrasive machining. A semibondedabrasive grinding plate is used in the semibonded abrasive machining. Abrasive particle of 1000#Green SiC and bond named SSB are adopted in the manufacture of the plate. Four plates withdifferent concentration of bond which are 1.5%, 2.5%, 3.5%, 4.5% respectively are made. The paperstudies the effect of concentration of bond, the control parameters which include the lapping time, theload, and the rotating velocity of the plate on the surface roughness. Experimental results indicateeach plate with different concentration of bond can obtain fine surface roughness. When the load orthe rotating velocity increases, there is little effect on the surface roughness, but the materialremoval rate increases correspondingly. The initial roughness of the silicon wafer surface lappingby the plate could be improved from Ra 0.2μm to Ra 0.02μm in 9 min
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Advanced materials research Vol. 53-54 (July 2008), p. 161-166 
    ISSN: 1662-8985
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: The semibonded abrasive machining technique is expected to get high surface integrity andprocessing efficiency attributed to the „trap‟ effect which can reduce or even eliminate the surfacedamage induced by the larger particles. The goal of the work is to validate the „trap‟ effect by theexperiments of semibonded and loose abrasive machining under the conditions of adding and notadding the larger particles. Free surface damage monocrystal silicon wafers after polishing areadopted as workpieces, and 1000# SiC as abrasive particles while 180# SiC as the larger particles.The cast iron plate is used as grinding plate in the loose abrasive machining and different bondconcentration semibonded abrasive grinding plate SSB-1 and SSB-2 are used as grinding plates insemibonded abrasive machining. The roughness Rv and SEM photos of workpieces surface aretested to evaluate the extent of „trap‟ effect. The result shows that the semibonded abrasive grindingplate has the „trap‟ effect. The shore hardness value of the semibonded abrasive grinding plate canbe used to be one parameter to evaluate the degree of the ‟trap‟ effect of the semibonded abrasivegrinding plate
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 359-360 (Nov. 2007), p. 63-67 
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: The bond in a grinding wheel cements the abrasive grains together, Among other factors,the bond plays a predominant part in the grinding wheel performances and on the quality ofgrinding results. This paper presents a literature review on organic bond grinding wheels. Itdiscusses the characteristic of the bond and the grinding performances of the two mainly types oforganic bond [1] grinding wheels: the resin bond grinding wheel and the soft-elastic grinding wheel.This paper provide a conclusion of the studying state of organic grinding wheel, which newstudying can draw lesson from
    Type of Medium: Electronic Resource
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