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  • 1
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    EDP SCIENCES
    Publication Date: 2024-04-07
    Description: Botany and plant sciences
    Keywords: Botany and plant sciences ; thema EDItEUR::P Mathematics and Science::PS Biology, life sciences::PST Botany and plant sciences
    Language: English
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  • 2
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    Springer Nature | Springer Nature Singapore
    Publication Date: 2024-04-05
    Description: This open access book presents a comprehensive exploration of diffusion metamaterials that control energy and mass diffusion. Currently, if from the perspective of governing equations, diffusion metamaterials and wave metamaterials (pioneered by J. B. Pendry in the 1990s) are recognised as the two most prominent branches in the field of metamaterials. These two branches differ in their emphasis on the diffusion equation (as the governing equation) and time-dependent characteristic lengths in diffusion metamaterials, as opposed to the wave equation (as the governing equation) and time-independent characteristic lengths in wave metamaterials. Organized into three distinct parts – 'Thermal Diffusion Metamaterials', 'Particle Diffusion Metamaterials', and 'Plasma Diffusion Metamaterials' – this book offers a rigorous exploration spanning physics, engineering, and materials science, aimed at advancing our understanding of diffusion processes controlled by diffusion metamaterials. Incorporating foundational theory, computational simulations, and laboratory experiments, the book equips researchers and scholars across these disciplines with comprehensive methods, insights, and results pivotal to the advancement of diffusion control. Beyond facilitating interdisciplinary discourse, the book serves as a catalyst for innovative breakthroughs at the crossroads of physics, thermodynamics, and materials science. Essentially, readers will acquire profound insights that empower them to spearhead advancements in diffusion science (diffusionics) and the engineering of metamaterials.
    Keywords: Thermal Diffusion ; Particle Diffusion ; Plasma Diffusion ; Diffusion metamaterials ; Thermal metamaterials ; Theoretical thermotics ; Transformation thermotics ; thema EDItEUR::P Mathematics and Science::PH Physics::PHH Thermodynamics and heat ; thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGM Materials science ; thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGM Materials science::TGMB Engineering thermodynamics ; thema EDItEUR::P Mathematics and Science::PH Physics::PHS Statistical physics ; thema EDItEUR::P Mathematics and Science::PH Physics::PHF Materials / States of matter::PHFC Condensed matter physics (liquid state and solid state physics) ; thema EDItEUR::P Mathematics and Science::PH Physics::PHH Thermodynamics and heat ; thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGM Materials science ; thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials::TGM Materials science::TGMB Engineering thermodynamics ; thema EDItEUR::P Mathematics and Science::PH Physics::PHS Statistical physics ; thema EDItEUR::P Mathematics and Science::PH Physics::PHF Materials / States of matter::PHFC Condensed matter physics (liquid state and solid state physics)
    Language: English
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    Format: image/jpeg
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  • 3
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Solid state phenomena Vol. 136 (Feb. 2008), p. 115-124 
    ISSN: 1662-9779
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Physics
    Notes: Traditional sandwich structure consists of two face sheets and a core. With an internalsheet inserted into the core, a two-core sandwich structure is then formed. Two-core sandwichstructures with composite laminated face sheets and a thin internal sheet subjected to low velocityimpact are studied in this paper. Local displacement of the core under the point of impact isinvestigated. Simulated results show that the local displacement of the core along the direction ofthe impact has been decreased significantly by introducing the internal sheet into a traditional singlesandwich structure and by reducing the space between the internal sheet and the impacted face sheet.Shear deformation in the cores of a two-core sandwich structure is also investigated and attention isfocused on shear strains on interfaces between face/internal sheets and the cores. Results furthershow that strain levels in selected elements at the interested interfaces depend upon locations of theselected elements and arrangements of the internal sheet
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 326-328 (Dec. 2006), p. 99-102 
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Digital image correlation method (DICM) is described as a robust in-plane deformationmeasuring method due to its simple optical setup and the insensitivity against ambient noise. Basedon DICM, digital speckle projection has been developed for shape measurement. This paperexplores the possibilities for vibration analysis using digital speckle projection together with DICM.A digital speckle pattern, generated by computer, is projected on an object surface using an LCDprojector. Then the dynamic deformation modulated speckle images are captured by a high-speedCCD camera and saved in the computer. By using the self-developed temporal sequence digitalimages correlation algorithm, the deformation and vibration mode can be analyzed quantitatively.The proposed method avoids using stroboscopic or laser illumination and simplifies theexperimental setup for vibration measurement, while it is time-consuming thanks to calculating alarge amount of correlation coefficients. The experimental performance on a harmonic-vibratingcantilever beam well demonstrates the validity of the new method
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 339 (May 2007), p. 45-49 
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: A reasonable finite element (FE) model of grinding temperature field has been developedon the basis of analysis of the transient temperature field, and three kinds of boundary conditionsare loaded on the element of a moving heat source. The study, which is based on the finite elementprinciple, has been carried out using the numerical simulation software ANSYS. Many results havebeen obtained including three dimensional temperature distribution map. The simulated resultsunder different conditions show good agreement with the experimental results. With the comparisonof the dry-grinding and wet-grinding, the result shows that the wet-grinding temperature with aproper grinding fluid is rather lower than the dry-grinding temperature. Finally, the variablecoefficient of convective heat transfer and the different form heat source have been discussed indetail
    Type of Medium: Electronic Resource
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  • 6
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 532-533 (Dec. 2006), p. 472-475 
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Double sided polishing process has become a main machining method for silicon waferfinishing process, but it is difficult to get ultra-smooth surface with the very stringent machiningconditions. In this paper, the mechanism of ultra-smooth surface machining process was studied, themain parameters affecting the surface quality of silicon wafer, such as the polishing pad and carrierrotation speed, polishing press, polishing slurries etc. , were discussed and optimized, thenultra-smooth surface of silicon wafer with Ra 0.4nm has been obtained based on the above study. Anew double sided polishing machine with computer control system equipped with a digitalcontrolled press valve was developed, and the ultra-smooth machining process of silicon wafer wasestablished in this paper
    Type of Medium: Electronic Resource
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  • 7
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 315-316 (July 2006), p. 375-379 
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: The functional materials such as sapphire, silicon wafer etc. are processed efficientlywith ultra-smooth surface for the demand of the rapid development of the IC industry. The precisedouble sided polishing process is one of the main methods of getting the ultra-smooth surface forthese materials. This paper introduces the structure and characteristic of the precise double sidedpolishing machine with a precise pressure control system equipped a new type electro-pneumaticdigital servo valve. The works, such as machine design, development of the control system andoptimization of process parameters etc. are carried out to meet the requirement of the precise doublesided polishing machining process. This equipment has the characteristic of high machiningprecision and precise control capability, so it can be applied to the ultra-precise machining of theultra-thin sapphire, silicon wafers etc
    Type of Medium: Electronic Resource
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  • 8
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 539-543 (Mar. 2007), p. 4497-4502 
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Type of Medium: Electronic Resource
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  • 9
    Electronic Resource
    Electronic Resource
    Amsterdam : Elsevier
    Nuclear Physics, Section A 462 (1987), S. 482-490 
    ISSN: 0375-9474
    Keywords: Nuclear reactions
    Source: Elsevier Journal Backfiles on ScienceDirect 1907 - 2002
    Topics: Physics
    Type of Medium: Electronic Resource
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  • 10
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 90 (2001), S. 6151-6155 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: The time evolution of the quantum mechanical state of an electron is calculated in the framework of the effective-mass envelope function theory for an InAs/GaAs quantum dot. The results indicate that the superposition state electron density oscillates in the quantum dot, with a period on the order of femtoseconds. The interaction energy Eij between two electrons located in different quantum dots is calculated for one electron in the ith pure quantum state and another in the jth pure quantum state. We find that E11〉E12〉E22, and Eij decreases as the distance between the two quantum dots increases. We present a parameter-phase diagram which defines the parameter region for the use of an InAs/GaAs quantum dot as a two-level quantum system in quantum computation. A static electric field is found to efficiently prolong the decoherence time. Our results should be useful for designing the solid-state implementation of quantum computing. © 2001 American Institute of Physics.
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