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  • 1
    Electronic Resource
    Electronic Resource
    s.l. ; Stafa-Zurich, Switzerland
    Materials science forum Vol. 561-565 (Oct. 2007), p. 1729-1732 
    ISSN: 1662-9752
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: The formation process of intermetallic compound under Ni+ion implantation into pure Alwas studied at lower temperature below room temperature. Ion implantation was carried out using250KeV ion accelerator. Cascade damage was introduced Ni+ions implantation at 223K withoutnew phase nucleation. However, when Ni+ions were implanted at room temperature, the grownlarger plate-like phases were observed during implantation up to 1x1017 Ni+/cm2. Ni concentrationin Al matrix and newly formed phase were 0.3-0.5 and 8.5-13.3at%,respectively. It was identifiedthat the formed phases were close to the ordered orthorhombic structure of Al3Ni type. It was alsoconfirmed from observation with high resolution HVEM that these phases grew with continuous ionimplantation. Thus it was clarified that cascades act as preferential nucleation site for intermetalliccompound, and the phases nucleated at cascades coalesce in the growth process of each phaseduring continuous implantation through ion irradiation enhanced diffusion
    Type of Medium: Electronic Resource
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