ISSN:
1662-9752
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Affection of the main process parameters(Temperature and Time) on microstructureand properties of Ti(C,N)/Ni interface has been studied by using Cu and Nb interlayer in Vacuumdiffusion welding device. Results have shown that interface interlayer did not change and interfacemicrostructure was Cu/Nb layer structure and Cu diffused into Ni with a little when diffusionwelding temperature was lower than 1273K. But when diffusion welding temperature was 1523K,interface microstructures were Ni8Nb metallic compound and dispersing deposition CuNi solidsolution in the earlier, finally they were transformed into (Ti,Nb)(C,N)+Nb7(Ni,Ti,Cu)6+NbNi3 nearTi(C,N) and NiCu+NbNi8 near Ni. It was clear that Cu was as transition liquid which dissolved Niso as to forming CuNi transition liquid, so that Nb was dissolved in CuNi transition liquid rapidly.Ti(C,N) can been wetted with creating NiNbCu transition liquid, and then, a little (Ti,Nb)(C,N)solid solution were formed at interface so as to increasing interface combining capability. Interfaceshear strength may get to 140 MPa
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/15/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.539-543.4042.pdf
Permalink