Emerald Fulltext Archive Database 1994-2005
Electrical Engineering, Measurement and Control Technology
Tape ball grid array (TBGA) packages offer many of theadvantages of plastic BGAs, namely excellent durability, improved board space utilisation and ease ofsurface mount assembly along with the associated yield improvements. TBGA packages go a stepfurther, however, and offer the added benefits of improved signal integrity, better heat dissipation, andextendability to higher pin counts. This paper outlines the design and material selection process toproduce a low-cost TBGA which allows the wire bonding of a die. This type of packageoffers an attractive solution for applications requiring mid to high I/O capability and good electricaland thermal properties. Preliminary results have demonstrated the feasibility of wire bonding to thispackage at temperatures up to 200°C.
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