ISSN:
0305-6120
Source:
Emerald Fulltext Archive Database 1994-2005
Topics:
Electrical Engineering, Measurement and Control Technology
Notes:
Polymer thick film (PTF) technology provides the lowest cost, cleanest and most efficient manufacturing method for producing flexible circuits. Non-contact radio frequency (RF) smart cards and related information transaction devices, such as RFID tags, appear to be a good fit for PTF-flex. Flip chip also seems well suited for these "contactless" RF transceiver products. Flip chip and PTF adhesive technologies are highly compatible and synergistic. All PTF SMT adhesives assembly methods are viable for flip chip. However, the merging of flip chip with PTF-flex presents major challenges in design, materials and processing. This paper will compare assembly methods and discuss obstacles and solutions for state-of-the-art flip chip on flex within the RFID product environment.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1108/03056129910733542
Permalink