ISSN:
1077-3118
Source:
AIP Digital Archive
Topics:
Physics
Notes:
The evolution of electrical resistance, stress, and microstructure during annealing has been studied on 100 nm NiFe(20 wt %)/200 nm Cu/100 nm NiFe trilayers. Irreversible resistance changes and the concentration-depth profiles show that, at and above 200 °C, diffusion of Ni into Cu as well as of Cu into NiFe occurs. The interdiffusion is held for an important failure mechanism of Cu/NiFe-based magnetoelectronic system at elevated temperatures. © 2000 American Institute of Physics.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1063/1.126975
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