ISSN:
1013-9826
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
For a quantitative analysis and better understanding of the stress-strain response and theireffects on interface debonding and crack initiation and propagation of alternative hard and softmulti-layers under circumscription loading, to explore methodologies of optimum design of surfacemulti-layers, large strain elasto-plastic finite element method is used to evaluate the mechanicalbehaviors of TiN/Ti multi-layer films on rigid substrate under hard asperity indentation. Theresults show that with the same total thickness of the film, the alternate hard and soft multi-layerswith larger ratio could endure larger circumscription loading, and the different total thickness ofmulti-layers could affect the circumscription loading greatly. So there must be a circumscriptionloading in this multi-layer film structures. Generally speaking, the circumscription loading hassomething to do with the material modulus, the radius of the press-head, the thickness ratio of softand hard layers, and the total thickness of alternate hard and soft multi-layers. For a quantitativeanalysis of this problem, finite element method is utilized to analyze the phenomena of the plasticindentation. According to analysis of the film deformation, the maximum bending stress, and thesurface bending stress, and those parameters that have influence on different alternative films arestudied. The study of this paper is expected to provide some theoretical basis for the optimumdesign of multi-layer film structures
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/54/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.340-341.325.pdf
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