ISSN:
0305-6120
Source:
Emerald Fulltext Archive Database 1994-2005
Topics:
Electrical Engineering, Measurement and Control Technology
Notes:
Laminated substrates are used widely in the manufacture of multichipmodules (MCM-L) by the electronic packaging industry. Of late, the thrust hasbeen towards higher density circuitry to achieve improved performance and reduced size. This hasled to the use of finer lines and spacings, smaller drilled holes and buried vias in organic laminates leading to reliability issues such as electrochemical migration. One of theforms of electrochemical migration is known as conductive filament formation. Conductive filamentformation is an electrochemical process. In accelerated environments of temperature and humidity,organic laminates can develop a loss of insulation resistance between conductors, eventually resultingin loss of electrical function of the circuit. The paper aims at discussing electrochemical migration ingeneral, and conductive filament formation in particular, and its impact on the reliability ofMCM-L.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1108/03056129610799868
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