Electronic Resource
[S.l.]
:
American Institute of Physics (AIP)
Journal of Applied Physics
63 (1988), S. 2406-2413
ISSN:
1089-7550
Source:
AIP Digital Archive
Topics:
Physics
Notes:
The fractional contributions of the various SiHn radicals (n=0–3) to deposition are calculated for low-power, pure-silane rf and dc discharges. This is done using a radical diffusion plus reaction equation, combined with current knowledge of SiH4 dissociation fractionation, of SiHn+SiH4 reactions, and of the distributed source of radicals. The conclusion reached is that more than 98% of neutral radical deposition is by SiH3 for typical deposition pressures (〉100 mT at 240 °C). The effect of SiH3+SiH3 reactions at higher power is also evaluated using an estimated reaction rate coefficient (k3). The resulting loss in deposition rate is given as a function of film growth rate and of k3.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1063/1.341034
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