ALBERT

All Library Books, journals and Electronic Records Telegrafenberg

feed icon rss

Your email was sent successfully. Check your inbox.

An error occurred while sending the email. Please try again.

Proceed reservation?

Export
Filter
Collection
Publisher
Years
  • 1
    Electronic Resource
    Electronic Resource
    Bradford : Emerald
    Circuit world 25 (1999), S. 18-26 
    ISSN: 0305-6120
    Source: Emerald Fulltext Archive Database 1994-2005
    Topics: Electrical Engineering, Measurement and Control Technology
    Notes: Multi-layer surface finish, from the bottom to top, of electroless Ni, electroless Pd, and immersion Au (Ni/Pd/Au) have been introduced in the printed circuit board (PCB) industry recently. This paper reports an evaluation of this surface finish from the perspective of solder joint attachment reliability, especially to see if the Ni/Pd/Au could be immune from the brittle interfacial fracture of PBGA on electroless Ni/immersion Au, recently observed and reported by us. PCBs with Ni/Pd/Au finishes, made from two vendors with varied Pd layer thickness were attached with PBGA packages, and tested in four-point bending. When joint strength is strong, bending tests resulted in peeling off the PCB pads; otherwise, brittle fractures occurred at the interface between solder balls and PCB pads. After aging, solder joints on all Ni/Pd/Au and reference metal finishes failed by the same brittle fracture at the interface between Ni-Sn and Au-Sn intermetallic compounds. It is concluded that the interfacial fracture was controlled by something other than the Pd, and the existence of the Pd did not prevent the interfacial fracture. Also, the presence of Pd could not prevent the Au migration and subsequent fracture.
    Type of Medium: Electronic Resource
    Location Call Number Expected Availability
    BibTip Others were also interested in ...
Close ⊗
This website uses cookies and the analysis tool Matomo. More information can be found here...