ISSN:
1662-9752
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
In 3C-SiC MOSFETs, planar defects like anti-phase boundaries (APBs) and stacking-faults (SFs) reduce the breakdown voltage and induce leakage current. Although the planar defect density can be reduced by growing 3C-SiC on undulant-Si substrate, specific type of SFs, which expose the Si-face, remains on the (001) surface. Those SFs increase the leakage current in devices made with 3C-SiC. In order to eliminate the residual SFs, an advanced SF reduction method involving polarity conversion and homo-epitaxial growth was developed. This method is called switch-back epitaxy (SBE) and consists of the conversion of the SF surface polarity from Si-face to C-face and following homo-epitaxial growth. The reduction of the SF density in SBE 3C-SiC results in a tremendous improvement of the device performance. The combination of the achieved blocking voltage with the demonstrated high current capability indicates the potential of 3C-SiC vertical MOSFETs for high and medium power electronic applications such as electric and hybrid electric vehicle (EV/HEV) motor drives
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/20/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.600-603.89.pdf
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