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  • 1
    Electronic Resource
    Electronic Resource
    College Park, Md. : American Institute of Physics (AIP)
    The Journal of Chemical Physics 117 (2002), S. 2635-2644 
    ISSN: 1089-7690
    Source: AIP Digital Archive
    Topics: Physics , Chemistry and Pharmacology
    Notes: Photodissociation spectra of free doubly charged anions IrX62− (X=Cl,Br) were measured in the photon energy range from 1.5 to 2.9 eV. Both data sets show the same features as the spectra of the respective aqueous solutions. Compared to solution, the gas phase absorption bands of IrBr62− are redshifted by 0.01–0.15 eV. For IrCl62− no such shift could be observed. Photodissociation of IrBr62− results in the formation of Br−, IrBr4−, and IrBr5−. Fluence dependent measurements of fragment formation as well as parent ion depletion, allowed inferences regarding the dissociation pathway and the inner barrier height for the dissociation process which was estimated to be 1.6±0.2 eV. From measurements of the kinetic energy released upon fragmentation into monoanions, we estimate the outer barrier height to be 2.2±0.2 eV. © 2002 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Bradford : Emerald
    Circuit world 30 (2004), S. 11-15 
    ISSN: 0305-6120
    Source: Emerald Fulltext Archive Database 1994-2005
    Topics: Electrical Engineering, Measurement and Control Technology
    Notes: There is increasing customer demand for materials with low dissipation factors for reduced loss along the traces and low dielectric constants for higher signal propagation speeds. High performance epoxies such as Nelco's N4000-13, Isola's FR408 and General Electric's GETEK (similar to Matsushita's MEGTRON) have become essential for boards operating in the higher frequency range. For applications at the highest frequencies material choices are very limited. These materials, tailored for high frequency use, have disadvantages - either with their thermomechanical properties or with their processability. Recently, a number of new "high frequency" or "low loss" materials have been introduced by different suppliers. In an overall relatively small but growing market, these materials have to demonstrate their advantages - from an electrical, thermomechanical, processing, fabrication quality and/or cost standpoint when compared to the established materials. This paper compares the thermomechanical performance and fabrication quality of new "high frequency"/"low loss" base materials.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    Bradford : Emerald
    Circuit world 28 (2002), S. 38-45 
    ISSN: 0305-6120
    Source: Emerald Fulltext Archive Database 1994-2005
    Topics: Electrical Engineering, Measurement and Control Technology
    Notes: Currently, the most widely used Printed Circuit Board (PCB) base material is the glass reinforced epoxy known as FR-4. To improve the electrical or the thermomechanical performance of PCBs, there are two possibilities from a material standpoint: a modification or change of the resin system and a change of the reinforcement. Currently, there are a number of resins used for high performance PCB base materials. These resin systems offer higher Tgs and lower z-axis-expansions for improved through hole reliability. Non-halogenated epoxy resin systems are offered for the production of green PCBs. In addition to new resins, new reinforcements are available for use in PCBs. Which can improve the electrical parameters of the base material and the x and y axis- thermal expansion also changes with the use of those reinforcements. This paper compares the thermomechanical and electrical parameters of some new high performance and green base materials with the glass reinforced epoxy materials commonly used in both high layer count boards and microvia applications.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    Bradford : Emerald
    Circuit world 31 (2005), S. 3-13 
    ISSN: 0305-6120
    Source: Emerald Fulltext Archive Database 1994-2005
    Topics: Electrical Engineering, Measurement and Control Technology
    Notes: Purpose - Aims to explain the main requirements for printed circuit boards (PCBs) and to determine the survival rate of boards in lead-free assembly. Design/methodology/approach - The first two main requirements are the survival of 5-6 cycles lead free reflow with peak temperatures of up to 260°C and an identical or even better board reliability of such boards compared to todays eutectic soldered ones. In a first series of tests the influence of base materials, reflow temperature gradient and peak temperature on PCB survival rate are investigated. Thermo-mechanical data of different epoxy-based materials are compared to survival rate investigations using repeated reflow tests. The impact of PCB manufacturing and design on the lead free performance is discussed. A second series of investigations is air-to-air life cycle tests of daisy chain boards out of different epoxy-based materials with varying preconditioning were done. Findings - The tests showed that dicy cured epoxy base materials are not able to withstand the thermal stress of the mentioned soldering steps. Board design and the heating gradient in reflow also influence the assembly performance. Thermal cycling tests (air-to-air), showed clearly the effect of reflow temperature and number of reflow cycles on through-hole reliability. There was no significant impact of z-axis-expansion on the through-hole failure rate in air-to-air cycling. Originality/value - Provides further information on the lead-free assembly of PCBs.
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    Oxford, UK : Blackwell Publishing Ltd
    Annals of public and cooperative economics 5 (1929), S. 0 
    ISSN: 1467-8292
    Source: Blackwell Publishing Journal Backfiles 1879-2005
    Topics: Economics
    Type of Medium: Electronic Resource
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  • 6
    Electronic Resource
    Electronic Resource
    Oxford, UK : Blackwell Publishing Ltd
    Annals of public and cooperative economics 5 (1929), S. 0 
    ISSN: 1467-8292
    Source: Blackwell Publishing Journal Backfiles 1879-2005
    Topics: Economics
    Type of Medium: Electronic Resource
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  • 7
    Electronic Resource
    Electronic Resource
    Oxford, UK : Blackwell Publishing Ltd
    Annals of public and cooperative economics 7 (1931), S. 0 
    ISSN: 1467-8292
    Source: Blackwell Publishing Journal Backfiles 1879-2005
    Topics: Economics
    Type of Medium: Electronic Resource
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  • 8
    Electronic Resource
    Electronic Resource
    Oxford, UK : Blackwell Publishing Ltd
    Annals of public and cooperative economics 7 (1931), S. 0 
    ISSN: 1467-8292
    Source: Blackwell Publishing Journal Backfiles 1879-2005
    Topics: Economics
    Type of Medium: Electronic Resource
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  • 9
    Electronic Resource
    Electronic Resource
    Oxford, UK : Blackwell Publishing Ltd
    Annals of public and cooperative economics 4 (1928), S. 0 
    ISSN: 1467-8292
    Source: Blackwell Publishing Journal Backfiles 1879-2005
    Topics: Economics
    Type of Medium: Electronic Resource
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  • 10
    Electronic Resource
    Electronic Resource
    Amsterdam : Elsevier
    Tetrahedron Letters 32 (1991), S. 5907-5910 
    ISSN: 0040-4039
    Source: Elsevier Journal Backfiles on ScienceDirect 1907 - 2002
    Topics: Chemistry and Pharmacology
    Type of Medium: Electronic Resource
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