ISSN:
1662-9752
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Solder fatigue is one of the major product reliability concerns in electric packagingdesign. In this paper, the application of a mesh-insensitive structural stress method, previouslydeveloped by the authors, is demonstrated for characterizing fatigue of solder joints under thermalfatigue and mechanical fatigue conditions. Three sets of experimental data from literature areanalyzed to demonstrate the effectiveness of the structural stress method in its ability to correlatetest data over different packaging designs, test methods, etc. As evidenced in this study, the meshinsensitivestructural stress method offers a simple but effective means to correlate the fatiguebehavior of solder joints among various test conditions. The results show that the structural stressmethod can be used as an effective alternative to existing methods in the literature, in reliabilitydesign of electronic packaging
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/18/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.580-582.233.pdf
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