Electronic Resource
Bradford
:
Emerald
Circuit world
25 (1999), S. 35-40
ISSN:
0305-6120
Source:
Emerald Fulltext Archive Database 1994-2005
Topics:
Electrical Engineering, Measurement and Control Technology
Notes:
This paper explores the capability of electroless copper deposition plus acid copper electroplating to metallize high aspect ratio microvias.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1108/03056129910258324
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