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  • 1
    Electronic Resource
    Electronic Resource
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 9 (1969), S. 56-72 
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: This paper is the third in a series describing work done under Air Force sponsorship to develop high temperature polyimide laminates for radomes and other parts for supersonic aircraft.Twelve resin compositions are described and evaluated. Most were prepared from benzophenonetetracarboxylic dianhydride and one or more aromatic diamines. Modifying linkages such as amide, ether, benzimidazole, and oxadiazole were present in some cases.A variety of precure and pressing conditions were studied, best results being obtained with a fully cured prepreg pressed at about 700°F and 200-1000 psi. Most of the laminates were made with E glass cloth, but some work was done also with S glass, Refrasil, and carbon cloth.Initial flexural strengths on E glass of 35-60,000 psi at room temperature, and 20-40,000 psi at 600°F were observed for the better resins. On S glass, slightly higher strengths were observed together with values of about 10,000 psi at 700-1000°F. Aging data on E glass laminates show retention of at least 10,000 psi flexural strength at temperature for about 250 hrs. at 650°F, 1000 hrs. at 600°F, 5000 hrs. at 527°F, and 30,000 hrs. at 482°F.Dielectric constant and dissipation factor at 10 Gc were found to be nearly constant at 3.5-4.4 and 0.005-0.01, respectively, for temperatures up to 662°F and for aging up to 1000 hrs. at 600°F. At frequencies of 60 c and 1 Kc, an increase of dissipation factor with temperature was found and was used as a measure of Tg.
    Additional Material: 13 Ill.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    New York, NY [u.a.] : Wiley-Blackwell
    Journal of Applied Polymer Science 12 (1968), S. 805-829 
    ISSN: 0021-8995
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: During the past decade the aerospace industry has sought materials for bonding stainless-steel and titanium alloys that have a high degree of thermal and oxidative stability. The Air Force Materials Laboratory has anticipated these requirements and sponsored many development programs aimed at achieving these goals. This paper describes the results of one such program devoted to development of high-temperature adhesives from aromatic imide polymers. The family of polymeric materials known as aromatic polyimides possess excellent thermal and oxidative resistance at temperatures up to 650°F. Mechanical and electrical properties of glass-fiber-reinforced laminates prepared with these polymers have been reported. This work has been extended to the development of structural adhesives that will withstand long-time exposure in air at 600°F. Stainless steel and titanium have been successfully bonded with adhesives made from aromatic imide and benzimidazole imide polymers. Bonds made with stainless steel have retained approximately 80% of their original strength at 600°F. after 1000 hr. of aging at 600°F. Adhesives made with benzimidazole imide polymers are the prepared materials for bonding titanium. Initial bond strengths of 1300 psi have been measured at 600°F. After 1000 hr. at 600°F. the bond strengths drop to 800 psi. The processing conditions for making a bond are quite moderate, except that a high temperature is required. The preparation and processing conditions associated with these adhesives are described. A large number of aromatic imide and amide-imide polymers have been prepared and adhesives formulated. By comparing the bond strengths obtained with these adhesives it is possible to deduce the effect of molecular weight and various molecular components on bond strength.
    Additional Material: 9 Ill.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    New York : Wiley-Blackwell
    Journal of Polymer Science Part A-1: Polymer Chemistry 6 (1968), S. 877-887 
    ISSN: 0449-296X
    Keywords: Physics ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology
    Notes: Linear polyimides prepared from m-phenylene diamine (MPD) and 3,4,3′,4′-benzophenonetetracarboxylic dianhydride (BTDA) were modified so as to be thermosetting. This was done by replacing a portion of the MPD with either 2,4-diaminoacetanilide or p-(2,4-diaminophenoxy) acetanilide and 3,5-diaminobenzoic acid; it is thought that during final processing of the laminates the carboxyl group and the acetamido group react, forming amide crosslinks. Alternatively, excess anhydride was incorporated into the polymer to react with some of the attached acetamido groups; these would give imide crosslinks. A series of resins and glass-reinforced laminates incorporating these resins was prepared. The laminates were aged and tested at 315°C. Flexural strength at 315°C. versus hours aged at 315°C. is presented. Flexural strength after 100 hr. at 315°C. for two of the better laminates from modified polymers was about 48,000 psi, compared to 24,000 psi for the straight linear polymer. The flexural strength of the modified polymers decreased more rapidly, however, and after 1000 hr. of aging at 315°C. the flexural strength of the best laminates, including the linear polymer, was 12,000 psi.
    Additional Material: 9 Ill.
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  • 4
    Electronic Resource
    Electronic Resource
    New York : Wiley-Blackwell
    Journal of Polymer Science Part A-1: Polymer Chemistry 6 (1968), S. 215-233 
    ISSN: 0449-296X
    Keywords: Physics ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology
    Notes: Three series of aromatic primary diamines were synthesized. The first series of three contained one or two hydrazide groups. The second series of five contained one or two oxadiazole groups. The third series of four contained one or two benzimidazole groups. Reaction of each diamine with either pyromellitic dianhydride or 3,4,3′,4′-benzophenonetetracarboxylic dianhydride gave a series of soluble polymeric amic acids, from which films of good thermal stability were cast. The heat-cured films were either oxadiazoleimide or benzimidazole-imide polymers, depending upon the diamine used. When hydrazide-amic acid polymers were heated, the conversion of amic acid to imide was essentially complete before any substantial portion of the hydriazide linkages were converted to oxadiazole. The latter conversion was accompanied by degradation. A better method of preparation for these polymers is through the oxadiazole contaning diamines. One hydrazide-imide polymer was prepared from trimellitic anhydride and was converted to an oxadiazole-imide by heating. The reaction of equimolar quantities of a dianhydride with 3,5,2′-triaminobenzanilde gave a soluble polymer which was converted to a benzimidazole-imide by heating.
    Additional Material: 7 Tab.
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