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  • 1
    Electronic Resource
    Electronic Resource
    Wear-Resistant Property of SiCp/Al Composites (2008)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 368-372 (Feb. 2008), p. 1096-1098 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Al alloy reinforced with SiCp (size: 70-220μm) was fabricated by pressureless-infiltration. Itswear resistant property was investigated under different heat-treatment conditions, and morphology ofworn surface was examined. The results showed that the composite was integrated, uniform and compact,and its wear resistant property was better than that of the unreinforced matrix alloy. It was indicated thatsome rigid SiCp in the abraded surface of the composite could support part of loads and replace matrix towear-tear, which improved the wear resistant property. Compared to annealing, solution agingstrengthens Al alloy matrix and cohesion with SiCp, and the wear resistant property of composites wasbetter. Combining interface is also an important factor which influences on wear resistant property.During the wear test, the smaller SiCp size, the more interfaces, there are more SiCp falling off because ofloosening combining interface, which results in more wear-tearing value. The wear rate of compositeincreases with decreasing SiCp size, thus, the composite with larger SiCp has better wear-resistantproperty than that with smaller SiCp. At last, the wear mechanism of the composite was also studied, andit showed that abrasive wear dominated in the abrasion process
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/56/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.368-372.1096.pdf
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  • 2
    Electronic Resource
    Electronic Resource
    Design of Rapid Powder Switch in Laser Cladding Rapid Manufacturing (2008)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 375-376 (Mar. 2008), p. 686-689 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: According to lateral powder system due to gravity, the controllable rapid powder switchis first tried based on the principle that air pressure can change the direction of power. Then, threekinds of modified schemes are provided based on the experiment to remedy the lack of first try.Finally, one scheme is selected and realized, which can solve the problem of synchronization oflaser and powder, and advance powder utilization factor
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/57/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.375-376.686.pdf
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  • 3
    Electronic Resource
    Electronic Resource
    Study of the Thermal and Intrinsic Stress of Large Area Diamond Film Prepared by HFCVD (2008)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 375-376 (Mar. 2008), p. 123-127 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: High residual stress that includes thermal and intrinsic stress is an obstacle to the furtherapplication of chemical vapor deposited diamond thick film. In this paper, CVD diamond thick filmwas deposited on silicon substrate by hot filament chemical vapor deposited (HFCVD) system. Thefinite element analysis (FEA) simulation and experimental research were carried out on the thermaland intrinsic stress of large area diamond thick film. The FEA model is set up to investigate thedistribution and magnitude of thermal stress. The intrinsic stress is studied by X-Ray diffraction“sin2ψ” method. The thermal stress and intrinsic stress are both compression stress. Simulationresults show the discontinuous sharp of the diamond film result in the stress concentration and lowcooling velocity is a good way to reduce thermal stress. The intrinsic stress is correlative with themicrostructure and non-diamond component of diamond film. The origin of the intrinsic stress isdiscussed in detail in this paper
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/57/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.375-376.123.pdf
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  • 4
    Electronic Resource
    Electronic Resource
    Experimental Research on Machining Performance of Parallel Machine Tool (2008)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 375-376 (Mar. 2008), p. 672-676 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: The machining accuracy and the surface roughness of workpieces machined by the PKMnamed BJ-04-02(A) are evaluated by machining experiments in this paper. The machining accuracyincludes that of size, shape and position. Size includes the diameter and length. Shape accuracyincludes straightness, roundness and cylindricity. Position accuracy includes perpendicularity,parallelism, inclination and concentricity. The experiment results show that the surface roughnessand the straightness basically meet the demand of JB/T8771.7-1998, but other accuracy indexes arenot consistent well with the mechanical standard. However, the machining accuracy becomes badwhen machining tool is far away from the center of the workspace
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/57/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.375-376.672.pdf
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  • 5
    Electronic Resource
    Electronic Resource
    Recognition for Spindle Speeds of Drill Press Based on Sound Signals Produced from Drilling (2008)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 375-376 (Mar. 2008), p. 535-538 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Effects of running state and spindle speeds on the sound signals produced from a drillpress are investigated. And the obtained sound signals by using of a sound level meter are analyzedin both time domain and frequency domain. It is evident that there is more high frequency energyfor drilling sound signals with load than without load. And spindle speeds still affect their energydistribution of drilling sound signals. Using wavelet decomposition and wavelet packetdecomposition, drilling sound signals are decomposed into a number of frequency bands. Andenergy percentages of the divided frequency bands are extracted to be the effective characteristics torecognize spindle speeds. Meanwhile, training error of different BP networks is compared to obtainthe effective network for recognition spindle speeds. By using of the obtained network structurenamed 16-30-5, the study rate for training samples and the recognize rate for testing samples are allabove 95%
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/57/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.375-376.535.pdf
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  • 6
    Electronic Resource
    Electronic Resource
    Mechanism of Brittle-Ductile Transition of Single Silicon Wafer at Different Temperatures (2007)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 359-360 (Nov. 2007), p. 1-5 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Formation, propagation and length of crack and hardness of single silicon wafer wereinvestigated at different temperatures by means of Vickers indentation, using lower temperaturetesting unit with semiconductor refrigerating chip and higher temperature testing unit with closedelectric furnace. The results show that the hardness of single silicon wafer decreases with the increaseof temperature, while the length of crack increases with the increase of temperature. Ductile-brittletransition of the single silicon wafer can occur at different temperatures with the increase of load.When the load is smaller and temperature is lower, no cracks can be found
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/55/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.359-360.1.pdf
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  • 7
    Electronic Resource
    Electronic Resource
    Study on the Surface Integrity of Polished Diamond Thick Film Prepared by EACVD (2007)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 359-360 (Nov. 2007), p. 319-323 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Chemical vapor deposited (CVD) diamond film is a good materials for cutting tools as itsa series of excellent properties. But because of its polycrystalline morphology, CVD diamond thickfilm has a rough surface that limits its application in engineering. In this paper, study was carriedout on the mechanical lapping of diamond film. It is shown that surface roughness of the film wasreduced from Ra 4.5μm to Ra 0.2μm after 50-minute polishing. The surface integrity of polisheddiamond thick film was investigated, which includes surface roughness, morphology and residualstress. There are a lot of micro defects such as grooves, gas cavities and micro cracks on thepolished surface, which are the intrinsic defects generated in the deposition process of CVDdiamond film. The tensile stress of the film reduced through polishing as the release of thedeformation energy stored in the film
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/55/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.359-360.319.pdf
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  • 8
    Electronic Resource
    Electronic Resource
    Polycrystalline Columnar Diamond Film Deposited on Spherical Substrate by DC Arc Plasma CVD (2008)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 373-374 (Mar. 2008), p. 134-137 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Diamond film was deposited on spherical molybdenum substrate by DC arc plasma CVDmethod. Diamond film morphology, purities and orientation evolution, obtained from atomic forcemicroscopy, scanning electron microscopy, Raman spectroscopy, X ray diffraction respectively, hasshowed that grains on the growth surface are compact, continuous and uniform. Characteristicdiamond (111), (220), (311) peaks were found and (111) facets were predominant. It revealed thatdiamond film was polycrystalline texture characteristic. There is a typical diamond Raman spectrumpeaks at 1332.0 cm-1, and not graphite and amorphous carbon characteristic peak. High puritydiamond film was deposited. When methane concentration was increased, diamond film has morelocal clusters and vacancy defects such as voids, graphite inclusion, and hydrogen cluster. Therefore,some important parameters such as methane concentration and substrate temperature should beoptimized in depositing diamond film
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/57/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.373-374.134.pdf
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  • 9
    Electronic Resource
    Electronic Resource
    Characterization of Diamond Spherical Shell Thick Film by DC Plasma CVD (2008)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 375-376 (Mar. 2008), p. 216-220 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Diamond spherical shell thick film was prepared by high power DC-plasma jet CVD.Atom force microscopy, scanning electron microscopy, Raman spectroscopy androughness-profile-meter were used to characterize microstructure, morphology, impurities andorientation evolution of diamond spherical shell thick film. The results show that, when nucleationbegins, grains grow random orientation. The grain size of spherical diamond film prepared iscompact, clear, uniform, continuous and no remarkable bigger grain over the whole surface of film.On the growth surface, (100) facets were dominant, and the cross-section SEM indicated that filmcolumnar spreading grew from the substrate surface to the diamond film surface. The roughness ofthe growth surface was much more than that of the nucleation surface. To adjust some importantparameters as methane concentrate, depositing time, and matrix temperature, and high qualitydiamond spherical shell thick film was deposited
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/57/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.375-376.216.pdf
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  • 10
    Electronic Resource
    Electronic Resource
    Experimental Research on Aluminum Alloy Blade’s Surface Roughness of Integrate Rotor Based on Four-Axis High Speed Milling (2008)
    s.l. ; Stafa-Zurich, Switzerland
    Key engineering materials Vol. 375-376 (Mar. 2008), p. 390-394 
    Details
    ISSN: 1013-9826
    Source: Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: It was carried out that a HSM test for aluminum alloy (2A70) rotor with carbide cutter. Itwas investigated and analyzed that the influence of different cutting speed and feed speed on theroughness of blade’s finished surface. The experiment showed that high quality surface was easy toobtain by increasing the cutting speed and decreasing the feed. But when the cutting speed crossedthe critical value, increase in the cutting speed caused slight decrease in the surface roughness. Thefeed decreased to a very small value, the roughness increased a little. It was expected that bestsurface roughness and machining efficiency could be obtained by selecting the appropriate cuttingspeed and feed
    Type of Medium: Electronic Resource
    URL: http://www.tib-hannover.de/fulltexts/2011/0528/01/57/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.375-376.390.pdf
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