ISSN:
1013-9826
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Micro electrical discharge machining (EDM), enhanced with ultrasonic vibration, isexplored and assessed as a method for developing microelectrode array, for microelectrode arrayfabricated by LIGA has shortcomings such as complex technology and high price. Based on themechanism of micro-EDM, micro-hole array discharges to fabricate microelectrode array by reversecopying. In the process of reverse copying, the thicker rod electrode can not rotate, resulting inelectric arc and short-circuit occurring easily, so it is necessary to add ultrasonic vibration on theplane plate electrode, in order to exclude debris as soon as possible and stabilize machining process.In the process of machining, four parameters, such as working voltage, working capacity, ultrasonicamplitude and holes spacing, are important to machining efficiency, each parameter has four typicalvalues. In order to reduce experiment times, a scheme of orthogonal experiment was designed withdifferent parameters combination. With result of experiments, the ratio of mean square deviation toerror mean square deviation of each parameter was calculated and significance of each parameterwas obtained, and the best parameters combination was asserted through theoretical calculation.Also, experimental study of using microelectrode array to machine micro-hole array by Micro-EDM was made and influence curve of each parameter was drawn. Finally, 5×5 arrays ofmicroelectrode were obtained, the diameter of single electrode is less than about 30.m and heightto-width aspect ratios is more than 8, moreover, these microelectrode arrays have good coaxialityand surface quality
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/56/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.364-366.482.pdf
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