ISSN:
1013-9826
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
A novel conditioning technique to precisely and effectively condition the nickelelectroplated mono-layer coarse-grained diamond grinding wheel of 91[removed info]m grain size was developedto fabricate a Diamond Micro Tool Array (DMTA) in ductile machining of brittle materials. Duringthe fabricating process, a copper bonded diamond grinding wheels (91[removed info]m grain size) dressed byELID (electrolytic in-process dressing) was applied as a conditioner, a force transducer was used tomonitor the conditioning force, and a coaxial optical distance measurement system was used to insitumonitor the modified wheel surface status. The experimental result indicates that the newlydeveloped conditioning technique is applicable and feasible to generate required wheel topographyof less than 2μm run-out error and grain geometries. The taper cutting test on BK7 proves thefabricated DMTA is capable of realizing ductile machining of brittle materials
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/01/52/transtech_doi~10.4028%252Fwww.scientific.net%252FKEM.329.737.pdf
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