ISSN:
1432-0630
Keywords:
PACS: 33.60.Fy; 61.16.Ch; 61.72.Mm; 66.30.-h; 68.35.Md; 68.55.-a
Source:
Springer Online Journal Archives 1860-2000
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Physics
Notes:
Abstract. In this study, the grain boundary diffusion of Cu through a TiN layer with columnar structure was investigated by X-ray photoelectron spectroscopy (XPS). It was observed that Cu atoms diffuse from the Cu layer to the surface along the grain boundaries in the TiN layer at elevated temperature. In order to estimate the grain boundary diffusion constants, we used the surface accumulation method. The diffusivity of Cu through TiN layer with columnar structure from 400 °C to 650 °C is Db≈6×10−11exp(−0.29/(kBT )) cm2/s.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1007/s003390051062
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