ISSN:
1662-9752
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
To improve the joining efficiency of Bi-Sr-Ca-Cu-O ( BSCCO) superconducting tapes, anew diffusion bonding technology with a direct uniaxial pressing at high temperature wasdeveloped to join 61-filament tapes. It was observed that bonding parameters such as bondingpressure and holding time, significantly affected the critical current ratio (CCRo). A peak CCRovalue of 89 % for the lap-joined tapes was achieved at 3 MPa for 2 h when bonding temperaturewas 800 °C. Compared with the conventional diffusion bonding technology, this new technologyremarkably shortened the fabrication period and improved the superconductivity of the joints. Thebonding interface and microstructures of the joints were evaluated and correlated to the CCRo. Anuniaxial pressing at high temperature was beneficial to interface bonding, and there was an optimalpressure value for the CCRo
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/18/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.580-582.295.pdf
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