ISSN:
1662-9752
Source:
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
In this paper, the characteristics of bond interface and bonding mechanism wereinvestigated with peeling-off method. The fracture was observed and interfacial composition wascertified by map scanning of EDX (Energy dispersive X-ray analysis). Based on the features ofinterfacial characters, the actual joining area mainly distributed at bond periphery; non-bonded atbond center. When the bonding time was lower, the ratio of the bond length to its width was largerand elemental aluminum distributed discontinuously on the bond fracture, primarily at theperiphery. After aging, the fractures were also analyzed and Cu2Al3 intermetallic compound (IMC)was identified. The phenomena of bond interfacial tracings were analyzed, and the bondingmechanism was ascribed to plastic flow analyzed by finite element method based on the contactissues
Type of Medium:
Electronic Resource
URL:
http://www.tib-hannover.de/fulltexts/2011/0528/02/18/transtech_doi~10.4028%252Fwww.scientific.net%252FMSF.580-582.173.pdf
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