ISSN:
1573-4803
Source:
Springer Online Journal Archives 1860-2000
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Abstract The conditions prevailing during the deposition of thick metallic films by the hot-hollow cathode method were investigated. The spacial distribution of temperature, surface roughness, and depth of etch during the pre-deposition etching cycle was investigated for two different sample holder designs. The influence of substrate temperature and the angle of incidence of the vapour on the structure and adhesion of thick silver films to type 304 stainless steel was determined. The nature and strength of adhesion were evaluated on the basis of microscopic examinations and tensile test determinations. Similar evaluations were made on tensile test samples formed through electroplating copper and nickel onto the silver films instead of the joining of two silver-coated samples by hot-isostatic pressing.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1007/BF01160796
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