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    Preliminary reliability evaluation of flip chip on flex interconnect technology (1997)
    In:  CASI
    Details
    Publication Date: 2004-12-03
    Description: The study was carried out to evaluate the flip-chip-on-flex (FCOF) interconnection process in order to determine its feasibility for space flight applications. The key objectives were to: develop and apply simple and cost effective process steps needed to manufacture FCOFs and build test samples; perform a preliminary technology validation, and determine any initial environmental or application risks. The FCOF was shown to be simpler and more economical than other chip interconnection schemes.
    Keywords: Electronics and Electrical Engineering
    Type: ; 205-212
    Format: text
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