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  • 1
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 69 (1991), S. 8336-8345 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: A mathematical model of transport phenomena and epitaxial silicon growth in a pancake chemical vapor deposition reactor is presented for the SiH2Cl2-H2-HCl system. Two-dimensional conservation equations of mass, momentum, energy, and species mass developed in cylindrical coordinates along with appropriate boundary conditions are solved numerically with finite element methods. Streamlines show that the shearing force of the inlet gas flow yields recirculation zones inside the reactor and a separation point on the susceptor. Thermal and concentration boundary layers are seen to develop above the susceptor at pressures between 40 and 150 Torr, and susceptor temperatures between 850 and 1000 °C. When HCl is added to the SiH2Cl2-H2 system, as it is widely used in the selective epitaxial growth of silicon, the overall growth rate is reduced by silicon substrate etching. It is predicted that growth rates for bulk and selective epitaxy decrease monotonically with increasing HCl/SiH2Cl2 or (HCl)2/SiH2Cl2 feed flow ratios; also, this model predicts an optimal HCl/SiH2Cl2 feed flow ratio at which silicon growth rates on patternless and patterned wafers are equal to each other. The agreement between experimental and predicted growth rate profiles on patternless wafers at different temperatures and flow rates studied is seen to be satisfactory.
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  • 2
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 87 (2000), S. 2046-2051 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: X-ray photoelectron spectroscopy (XPS), secondary ion mass spectrometry (SIMS), and spectral ellipsometry have been used to study ozone/atomic oxygen assisted direct oxidation of single crystalline SiGe. In situ Fourier transform infrared spectroscopy is used to monitor changes in the gas phase composition of O3/O2 gas mixtures. At all temperatures studied, 125–530 °C, XPS results indicate that Ge is incorporated into the growing oxide as GeO2. Increasing the oxidation temperature causes a decrease in the percentage of Ge incorporated in the growing oxide and an increase in the silicon content. Further, at oxidation temperatures of 400 °C and above, substantial Ge segregation is observed using SIMS. The change in composition is described using a temperature dependent flux model. Also, as the oxidation temperature increases, the oxide/SiGe interface becomes more abrupt with 1.9 monolayer (ML) of suboxide (Si+1, Si+2, Si+3) detected at 125 °C and 0.8 ML of suboxide at 530 °C. Based on thickness measurements from XPS and spectral ellipsometry, initial growth rates of 5 and ∼1 Å/min were achieved for ozone oxidation of Si0.85Ge0.15 at 530 and 125 °C, respectively. For the ultrathin regime (oxide thickness 〈25 Å), the effective activation energy for SiGe oxidation in 950 ppm of O3 is determined to be approximately 0.12 eV. © 2000 American Institute of Physics.
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  • 3
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 87 (2000), S. 8181-8186 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Rapid thermal oxidation (RTO) of Si in ozone gas is studied at temperatures between 200 and 550 °C, and the properties of the resulting ultrathin oxides are characterized using in situ mirror-enhanced reflection Fourier transform infrared (IR) spectroscopy. Thus, the frequency and intensity of the longitudinal optical vibrational mode of the Si–O–Si asymmetric stretching from ultrathin oxide films (〈30 Å) are probed in different processing environments and related to the oxidation kinetics and interfacial layer properties. The oxidation rate in ozone is found to be comparable to the one in pure oxygen at approximately 200 °C higher temperature. Analyses of the oxidation in ozone show a fast oxidation regime followed by a slow one with activation energies of 0.13±0.01 and 0.19±0.04 eV, respectively. Two regions are also observed for the oxidation in pure O2 with activation energies of 0.20±0.03 eV for the fast oxidation regime and 0.36±0.04 eV for the slow one. X-ray photoelectron spectroscopy results and IR spectral feature frequency shifts suggest that the RTO of silicon in ozone ambient results in a thinner, less-stressed interfacial layer than the one obtained in pure O2. Preliminary electrical characterization using surface charge analyses indicates that the oxides formed in ozone are of superior quality. © 2000 American Institute of Physics.
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  • 4
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 86 (1999), S. 1326-1330 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Since the presence of nitrogen is responsible for highly desirable properties of silicon oxynitrides in the ultra-large-scale integration era, the amount, position, and concentration profile of N in these films are of great interest. In this regard, we have studied several processing sequences (using successive oxynitridation/oxidation/oxynitridation steps) in order to obtain a bimodal N concentration profile with one peak close to the dielectric/Si interface and the other near the top surface of the dielectric. At 900 °C and 1 atm, it is found that the first oxynitridation step is required to incorporate less than a "critical" amount of N so that a bimodal profile is eventually obtained. Suggestions on how to optimize the concentration and profile of N within the silicon oxynitride film through process–property relationships are presented. Further, the flexibility in N incorporation offered by a mixed ambience of nitrous oxide (N2O) and nitric oxide (NO) coupled with the observation that pure NO processing incorporates about one order of magnitude more nitrogen than pure N2O processing could indeed result in novel approaches in designing and optimizing the chemical (electrical and physical) properties of the oxynitrides. Such results may have significant implications for microelectronic applications of the silicon oxynitridation technology. © 1999 American Institute of Physics.
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  • 5
    Electronic Resource
    Electronic Resource
    [S.l.] : American Institute of Physics (AIP)
    Journal of Applied Physics 89 (2001), S. 5170-5176 
    ISSN: 1089-7550
    Source: AIP Digital Archive
    Topics: Physics
    Notes: Ultrathin silicon oxide films thermally grown on Si (100) are characterized with mirror-enhanced polarized reflectance Fourier transform infrared spectroscopy (MEPR-FTIR). MEPR-FTIR is proposed to effectively probe properties of ultrathin films. Using a mirror and a polarizer, MEPR-FTIR overcomes the difficulty of weak IR intensities normally encountered in ultrathin gate dielectrics such as SiO2; the intensity of the silicon oxide longitudinal optical (LO) mode is found to increase by a factor of about 20. Therefore, FTIR spectrometers with sensitivity down to 0.01% may allow even submonolayer probing of silicon oxide on Si substrates. The relationship between film thickness and IR intensity of the LO mode at 1252 cm−1 is presented for silicon oxide films as thin as a few Å thick. Independent measurements with ellipsometry, cross-sectional transmission electron microscopy, and x-ray photoelectron spectroscopy as well as theoretical predictions using the general Fresnel function are utilized. Although nonlinear overall, the theoretically predicted relationship between the MEPR-FTIR intensity and film thickness is almost linear within the range 0–50 Å. Experimental data are shown to agree very well with the theoretical calculations for two different kinds of oxides: thermal oxides grown at 1050 °C and native oxides. Such results suggest that the MEPR-FTIR can be useful as an ex situ or in situ technique for thickness measurements and, in fact, for other properties of ultrathin gate dielectrics. © 2001 American Institute of Physics.
    Type of Medium: Electronic Resource
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  • 6
    ISSN: 1520-5827
    Source: ACS Legacy Archives
    Topics: Chemistry and Pharmacology
    Type of Medium: Electronic Resource
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  • 7
    Electronic Resource
    Electronic Resource
    s.l. : American Chemical Society
    The @journal of physical chemistry 〈Washington, DC〉 99 (1995), S. 4599-4608 
    Source: ACS Legacy Archives
    Topics: Chemistry and Pharmacology , Physics
    Type of Medium: Electronic Resource
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  • 8
    Electronic Resource
    Electronic Resource
    s.l. : American Chemical Society
    Industrial and engineering chemistry 23 (1984), S. 149-153 
    Source: ACS Legacy Archives
    Topics: Chemistry and Pharmacology , Process Engineering, Biotechnology, Nutrition Technology
    Type of Medium: Electronic Resource
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  • 9
    Electronic Resource
    Electronic Resource
    s.l. : American Chemical Society
    Industrial and engineering chemistry 24 (1985), S. 50-55 
    Source: ACS Legacy Archives
    Topics: Chemistry and Pharmacology , Process Engineering, Biotechnology, Nutrition Technology
    Type of Medium: Electronic Resource
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  • 10
    Electronic Resource
    Electronic Resource
    s.l. : American Chemical Society
    Macromolecules 19 (1986), S. 2174-2182 
    ISSN: 1520-5835
    Source: ACS Legacy Archives
    Topics: Chemistry and Pharmacology , Physics
    Type of Medium: Electronic Resource
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