ISSN:
1089-7623
Source:
AIP Digital Archive
Topics:
Physics
,
Electrical Engineering, Measurement and Control Technology
Notes:
For inspection of high aspect ratio structures like narrow semiconductor trenches, a thin membrane probe and a new force detection method have been proposed. Instead of conventional conical and pyramidal tips, a thin silicon nitride cantilever was set up vertically, and its edge was used as a tip. The membrane probe named as twist-probe (TP) was oscillated in the twisting resonance to detect a force from both vertical and lateral directions. About 100 μm long, 0.7 μm thick TP was fabricated as a trial. Amplitude versus distance curve measurements showed that the TP has a high spacing change sensitivity between the tip and a sample in both vertical and lateral directions. A trench cross-section imaging was demonstrated successfully with a TP and the twist resonant force detection method. © 1999 American Institute of Physics.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1063/1.1149708
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