Publication Date:
2019-08-30
Description:
Electronics Boxes with high heat dissipations use a thermal interface material to increase heat transfer to the radiator in a vacuum/space environment. There are lots of materials to choose from, but for Spacecraft applications, there are more than high heat transfer metrics which must be met. Contamination (both particle generation and outgassing), ease of cutting, and removal are just as important metrics in material selection. However, vendor data of material thermal conductance is usually based on a 1" X 1" piece of material under high uniform pressures. Large Electronics boxes almost never have optimal pressures, as they are bolted along the perimeter and leave gaps in the center regions. In order to characterize the relative thermal conductance for large Electronics boxes, an 8" X 8" plate was fabricated to simulate an electronics box bottom and bolted around the perimeter to a cold plate. Various thermal interface materials were inserted between the box and cold plate, and overall thermal conductance's were calculated. A table was generated which compares the full gamut of thermal interface materials for large boxes, from a dry joint to a wet joint. Materials were placed in order of high to low conductance's, so an engineer can compare the benefit of each material in a real-world scenario.
Keywords:
Fluid Mechanics and Thermodynamics
Type:
GSFC-E-DAA-TN70827
,
Thermal and Fluids Analysis Workshop (TFAWS 2019); Aug 26, 2019 - Aug 30, 2019; Hampton, VA; United States
Format:
application/pdf
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