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  • 1
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    Elastomer toughened polyimide adhesives (1985)
    In:  CASI
    Details
    Publication Date: 2019-06-28
    Description: A rubber-toughened, addition-type polyimide composition is disclosed which has excellent high temperature bonding characteristics in the fully cured state and improved peel strength and adhesive fracture resistance physical property characteristics. The process for making the improved adhesive involves preparing the rubber-containing amic acid prepolymer by chemically reacting an amine-terminated elastomer and an aromatic diamine with an aromatic dianhydride with which a reactive chain stopper anhydride has been mixed, and utilizing solvent or mixture of solvents for the reaction.
    Keywords: NONMETALLIC MATERIALS
    Type: NAS 1.71:LAR-12775-2
    Format: application/pdf
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    NASA TECHNICAL REPORTS
  • 2
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    Process for improving mechanical properties of epoxy resins by addition of cobalt ions (1984)
    In:  CASI
    Details
    Publication Date: 2019-06-28
    Description: A resin product useful as an adhesive, composite or casting resin is described as well as the process used in its preparation to improve its flexural strength mechanical property characteristics. Improved flexural strength is attained with little or no change in density, thermal stability or moisture resistance by chemically incorporating 1.2% to 10.6% by weight Co(3) ions in an epoxidized resin system.
    Keywords: COMPOSITE MATERIALS
    Type: NAS 1.71:LAR-13230-1
    Format: application/pdf
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    NASA TECHNICAL REPORTS
  • 3
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    Crystalline polyimides (1979)
    In:  CASI
    Details
    Publication Date: 2019-06-27
    Description: Aromatic crystalline polyimides are disclosed that are synthesized from polyamide-acid and when heated to 200 C to 300 C become cyclized to afford an opaque polymer. X-ray diffraction of the unoriented film exhibited 47 percent crystallinity. Differential scanning calorimetry reveals a melt at 425 C with no glass transition in these crystalline polyimides.
    Keywords: NONMETALLIC MATERIALS
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  • 4
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    LARC-TPI: A multi-purpose thermoplastic polyimide (1982)
    In:  CASI
    Details
    Publication Date: 2019-06-28
    Description: A linear thermoplastic polyimide, LARC-TPI, was characterized and developed for a variety of high temperature applications. In its fully imidized form, this material can be used as an adhesive for bonding metals such as titanium, aluminum, copper, brass, and stainless steel. LARC-TPI was evaluated as a thermoplastic for bonding large pieces of polyimide film to produce flexible, 100 void-free laminates for flexible circuit applications. The development of LARC-TPI as a potential molding powder, composite matrix resin, high temperature film and fiber is also discussed.
    Keywords: NONMETALLIC MATERIALS
    Type: NASA-TM-84516 , NAS 1.15:84516
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  • 5
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    Electrically conductive palladium containing polyimide films (1982)
    In:  CASI
    Details
    Publication Date: 2019-06-28
    Description: Lightweight, high temperature resistant, electrically conductive, palladium containing polyimide films and methods for their preparation are described. A palladium (II) ion-containing polyamic acid solution is prepared by reacting an aromatic dianhydride with an equimolar quantity of a palladium II ion-containing salt or complex and the reactant product is cast as a thin film onto a surface and cured at approximately 300 C to produce a flexible electrically conductive cyclic palladium containing polyimide. The source of palladium ions is selected from the group of palladium II compounds consisting of LiPdCl4, PdS(CH3)2Cl2Na2PdCl4, and PdCl2. The films have application to aerodynamic and space structures and in particular to the relieving of space charging effects.
    Keywords: INORGANIC AND PHYSICAL CHEMISTRY
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  • 6
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    A review of high-temperature adhesives (1981)
    In:  CASI
    Details
    Publication Date: 2019-06-28
    Description: The development of high temperature adhesives and polyphenylquinoxalines (PPQ) is reported. Thermoplastic polyimides and linear PPQ adhesive are shown to have potential for bonding both metals and composite structures. A nadic terminated addition polyimide adhesive, LARC-13, and an acetylene terminated phenylquinoxaline (ATPQ) were developed. Both of the addition type adhesives are shown to be more readily processable than linear materials but less thermooxidatively stable and more brittle. It is found that the addition type adhesives are able to perform, at elevated temperatures up to 595 C where linear systems fail thermoplastically.
    Keywords: NONMETALLIC MATERIALS
    Type: NASA-TM-83141
    Format: application/pdf
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  • 7
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    Elastomer toughened polyimide adhesives (1983)
    In:  CASI
    Details
    Publication Date: 2019-06-28
    Description: A rubber-toughened addition-type polyimide composition is disclosed which has excellent high temperature bonding characteristics in the fully cured state, and improved peel strength and adhesive fracture resistance physical property characteristics. The process for making the improved adhesive involves preparing the rubber containing amic acid prepolymer by chemically reacting an amine-terminated elastomer and an aromatic diamine with an aromatic dianhydride with which a reactive chain stopper anhydride was mixed, and utilizing solvent or mixture of solvents for the reaction.
    Keywords: NONMETALLIC MATERIALS
    Format: application/pdf
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    NASA TECHNICAL REPORTS
  • 8
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    Process for improving moisture resistance of epoxy resins by addition of chromium ions (1985)
    In:  CASI
    Details
    Publication Date: 2019-06-28
    Description: A process for improving the moisture resistance properties of epoxidized TGMDA and DGEBA resin system by chemically incorporating chromium ions is described. The addition of chromium ions is believed to prevent the absorption of water molecules.
    Keywords: NONMETALLIC MATERIALS
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    NASA TECHNICAL REPORTS
  • 9
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    Polyimides: Thermally stable aerospace polymers (1980)
    In:  CASI
    Details
    Publication Date: 2019-06-27
    Description: An up to date review of available commercial and experimental high temperature polyimide resins which show potential for aerospace applications is presented. Current government research trends involving the use of polyimides as matrix resins for structural composites are discussed. Both the development of polyimides as adhesives for bonding metals and composites, and as films and coatings for use in an aerospace environment are reviewed. In addition, future trends for polyimides are proposed.
    Keywords: NONMETALLIC MATERIALS
    Type: NASA-TM-81884
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  • 10
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    Aluminum ions enhance polyimide adhesive (1981)
    In:  Other Sources
    Details
    Publication Date: 2019-06-28
    Description: Adding complexed aluminum ions raises useful temperature of polyimide adhesive without embrittling it or reducing long term stability. Adhesives may be applied to prepared substrate surface without supports. Possible substrates are metal, composite, or polymeric film. Adhesive is excellent where bond flexibility is required.
    Keywords: MATERIALS
    Type: LAR-12640 , NASA Tech Briefs (ISSN 0145-319X); 5; 3; P. 326
    Format: text
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    NASA TECHNICAL REPORTS
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