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Dynamic DSC Characterization of Epoxy Resin by Means of the Avrami Equation (1999)

Lu, M. G. ; Shim, M. J. ; Kim, S. W.

Springer

Journal of thermal analysis and calorimetry 58 (1999), S. 701-709

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ISSN: 1572-8943

Keywords: Avrami expression ; CTBN ; cure kinetics ; epoxy

Source: Springer Online Journal Archives 1860-2000

Topics: Chemistry and Pharmacology

Notes: Abstract A phenomenological approach was used to characterize the cure processes of epoxy resins (a diglycidyl ether of bisphenol A and its modifier CTBN) from dynamic experiments by DSC. Various kinetic parameters were obtained by using a modified Avrami expression. The resulting overall activation energies for the two systems agreed very well with the published data in the whole cure temperature range. In contrast with the isothermal results and the general dynamic models, a change in the exponent and the non-linear temperature dependence of the rate constant were also observed.

Type of Medium: Electronic Resource

URL: http://dx.doi.org/10.1023/A:1010177116739

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