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  • 1
    Electronic Resource
    Electronic Resource
    Synthesis and modification of trifunctional epoxy resin with amine terminated polydimethyl siloxanes for semiconductor encapsulation application (1996)
    Springer
    Journal of polymer research 3 (1996), S. 125-131 
    Details
    ISSN: 1572-8935
    Keywords: Triglycidyl ether of tri(hydroxyphenyl)methane (TETM) ; Amine terminated polydimethyl siloxane (ATPDMS) ; Stress ; Flexural modulus
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Abstract Epoxy resins based on the triglycidyl ether of tris(hydroxyphenyl)methane (TETM) possess a very high heat distortion temperature and superior thermal oxidative stability over other types of epoxy resins. The high performance trifunctional epoxy resin (TETM) was synthesized by the condensation of a hydroxybenzaldehyde with phenol followed by epoxidation with a halohydrin. The structure of the synthesized TETM was confirmed by infrared (IR), mass spectra (MS), and nuclear magnetic resonance (NMR) spectroscopy. Amine terminated polydimethylsiloxanes (ATPDMS) were used to reduce the stress of trifunctional epoxy resin cured with phenolic novolac resin for electronic encapsulation applications. The dispersed silicone rubbers effectively reduce the stress of cured epoxy resins by reducing the coefficient of thermal expansion (CTE) and flexural modulus, while the glass transition temperature (Tg) is depressed by only a small amount.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01492903
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  • 2
    Electronic Resource
    Electronic Resource
    Synthesis and modification of a trifunctional epoxy resin with amino-terminated poly(dimethylsiloxane)s for semiconductor encapsulation (1997)
    Weinheim : Wiley-Blackwell
    Angewandte Makromolekulare Chemie 245 (1997), S. 125-137 
    Details
    ISSN: 0003-3146
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Physics
    Description / Table of Contents: Ein trifunktionelles Hochleistungs-Epoxidharz auf Basis des Triglycidylethers von Tris(4-hydroxyphenyl)methane (TETM) wurde durch Kondensation von 4-Hydroxybenzaldehyd mit Phenol and anschließender Epoxidierung mit Epichlorhydrin hergestellt. Zur Strukturaufklärung wurde das Produkt mittels IR- und NMR-Spektroskopie sowie Masenspektrometrie untersucht. Durch Modifizierung mit einem aminoterminierten Poly(dimethylsiloxan) wurde die Eigenspannung des mit einem Phenolnovolak vernetzten TETM für die Anwendung als Verkapselung elektronischer Bauteile herabgesetzt. Durch das in der TETM-Matrix frei verteilte Silikonelastomere konnte die Spannung des vernetzten Epoxidharzes deutlich reduziert werden, indem der thermische Ausdehnungskoeffizient und der Elastizitätsmodul des Materials verringert wurden, während die Glasübergangstemperatur kaum abnahm.
    Notes: A high-performance trifunctional epoxy resin based on the triglycidyl ether of tris (4-hydroxyphenyl)-methane (TETM) was synthesized by the condensation of 4-hydroxybenzaldehyde with phenol followed by epoxidation with epichlorohydrin. The structure of TETM was confirmed by mass spectra, infrared and nuclear magnetic resonance spectroscopy. Amino-terminated poly(dimethylsiloxane)s were used to reduce the stress of the trifunctional epoxy resin cured with phenolic novolac resin for electronic encapsulation application. The dispersed silicone rubbers effectively reduce the stress of cured epoxy resins by reducing the coefficient of thermal expansion and flexural modulus while the glass transition temperature was hardly depressed.
    Additional Material: 6 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/apmc.1997.052450111
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  • 3
    Electronic Resource
    Electronic Resource
    Aminosiloxane-modified epoxy resins as microelectronic encapsulants (1995)
    Weinheim : Wiley-Blackwell
    Angewandte Makromolekulare Chemie 224 (1995), S. 21-32 
    Details
    ISSN: 0003-3146
    Keywords: Chemistry ; Polymer and Materials Science
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Physics
    Description / Table of Contents: Für die Anwendung als Verkapselungsmaterial für elektronische Bauteile wurde ein epoxidiertes Kresol-Formaldehyd-Novolakharz zur Verbesserung der Festigkeit mit Amin-terminierten Poly(dimethylsiloxan)en (ATPDMS) modifiziert und mit einem Phenol-Formaldehyd-Novolakharz ausgehärtet. Sowohl der Einfluß des Molekulargewichts der ATPDMS auf die Separation der Elastomerphase von der Epoxidmatrix als auch mechanische und dynamisch viskoelastische Eigenschaften der mit Siloxan modifizierten Epoxidnetzwerke wurden untersucht. Die dispergierten Silikonkautschuke verbessern die Festigkeit der ausgehärteten Epoxidharze durch Verringerung des thermischen Ausdehnungskoeffizienten und des Biegemoduls, während die Glasübergangstemperatur kaum abgesenkt wird. Mit den Silikon-modifizierten Epoxidformmassen verkapselte elektronische Bauteile zeigen in der thermischen Schockprüfung ein ausgezeichnetes Verhalten, was sich in einer erhöhten Lebensdauer der Bauteile niederschlägt.
    Notes: Amine-terminated poly(dimethylsiloxanes) (ATPDMS) were used to improve the toughness of a cresol-formaldehyde novolac epoxy resin cured with a phenolic novolac resin for electronic encapsulation application. The effect of molecular weight of amine-terminated polysiloxanes on the phase separation of the resultant elastomers from epoxy matrix were investigated. Mechanical and dynamic viscoelastic properties of siloxane-modified epoxy networks were also studied. The dispersed silicone rubbers effectively improve the toughness of cured epoxy resins by reducing the coefficient of thermal expansion and flexural modulus, while the glass transition temperature was hardly depressed. Electronic devices encapsulated with the dispersed silicone rubber-modified epoxy molding compounds have exhibited excellent resistance to the thermal shock cycling test and have resulted in an extended device use life.
    Additional Material: 7 Ill.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1002/apmc.1995.052240103
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  • 4
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    Synthesis and properties of epoxy resins containing bis(3-hydroxyphenyl) phenyl phosphate (2000)
    Elsevier
    Details
    Publication Date: 2000-03-01
    Print ISSN: 0014-3057
    Electronic ISSN: 1873-1945
    Topics: Chemistry and Pharmacology , Physics
    Published by Elsevier
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  • 5
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    NOVEL COPOLYESTERS CONTAINING NAPHTHALENE STRUCTURES (1997)
    Elsevier
    Details
    Publication Date: 1997-03-01
    Print ISSN: 0014-3057
    Electronic ISSN: 1873-1945
    Topics: Chemistry and Pharmacology , Physics
    Published by Elsevier
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