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  • 1
    Electronic Resource
    Electronic Resource
    Bradford : Emerald
    Sensor review 19 (1999), S. 187-194 
    ISSN: 0260-2288
    Source: Emerald Fulltext Archive Database 1994-2005
    Topics: Electrical Engineering, Measurement and Control Technology
    Notes: Measurements of the ultrasonic sound speed of thermosetting resins and composites can be used as an in-process cure monitoring technique. Ultrasonic measurements have an advantage over other in-process techniques in that ultrasonic sensors do not make contact with the part (thus leaving no imbedded sensor or witness mark) and can make true bulk measurements of the part. A new commercially available ultrasonic cure monitoring system for the cure monitoring of thermosetting resins and composites has been developed. Advancements in ultrasonic sensor technology enable the self-contained ultrasonic sensor to be easily installed in a mold and maintain good coupling to the part during thermal cycling to 260°C. Data are presented showing the change in ultrasonic sound speed during the compression molding of epoxy prepregs. The data show a good relationship to the electrical resistivity data collected via dielectric cure monitoring. The ultrasonic technique is also applicable to phenolic based materials.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Stamford, Conn. [u.a.] : Wiley-Blackwell
    Polymer Engineering and Science 32 (1992), S. 524-528 
    ISSN: 0032-3888
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Chemistry and Pharmacology , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics , Physics
    Notes: Recent work has shown that moisture diffusion coefficients can be measured in thin polymer films through monitoring changes in permittivity with microdielectric sensors. The sensor is constructed in silicon and consists of an interdigitated electrode and two depletion mode field effect transistors. When operated in conjunction with appropriate external circuitry, the sensor measures dielectric constant and loss factor of any material placed on the SiO2 insulator and aluminum electrodes. The dielectric properties are measured locally within the first 10 microns of the film in contact with the sensor. As a thin polymer film on the sensor is exposed to a high relative humidity, the dynamically measured dielectric constant can be used to determine exactly when the moisture arrives at the polymer-SiO2 interface and the rate at which the concentration increases. The magnitude of the change in permittivity after equilibration has also been related to total amount of moisture uptake. In this investigation, several epoxy/amine films of varying mix ratios and cure state are cured on microdielectric sensors. The films, approximately 100 microns thick, are alternately exposed to wet and dry environments. Diffusion coefficients for both absorption and desorption are determined from the dielectric data as a function of cure state and epoxy/amine mix ratio. In addition, relative changes in amount of moisture uptake after equilibration is monitored.
    Additional Material: 6 Ill.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    Brookfield, Conn. : Wiley-Blackwell
    Polymer Composites 12 (1991), S. 87-90 
    ISSN: 0272-8397
    Keywords: Chemistry ; Chemical Engineering
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: With the relatively recent trend toward adaptive process control during processing of structural composites, there is need for an understanding of the nature of variations during cure that are encountered. Part-to-part variations can arise because of differences in thermal exposure arising from part placement or part thickness, or from chemical differences due to formulation or advancement. Microdielectric sensors are particularly well suited for monitoring thermoset cures from initial point of flow, through the liquid region, and on into the solid state. In this study, microdielectric sensors are used to systematically study the influence of resin advancement on cure behavior. Relationships between advancement and critical cure phenomena such as flow temperature, point of viscosity minimum, and reaction end point are discussed.
    Additional Material: 7 Ill.
    Type of Medium: Electronic Resource
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