ISSN:
1435-5663
Keywords:
Blackboard systems
;
Finite element systems
;
Multichip modules
;
Object-oriented
Source:
Springer Online Journal Archives 1860-2000
Topics:
Computer Science
,
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
,
Technology
Notes:
Abstract This paper addresses the application of the blackboard system architecture and object-oriented data abstraction techniques to the domain of finite element modeling and analysis. Specifically, a hierarchical object-oriented database was used to represent the physical system at different levels of abstraction including the user-defined physical system level, a computer-generated, simplified physical model level, and the finite element model level. Object link relationships within a given abstraction level and across different abstraction levels resulted in seamless bidirectional information exchange. The blackboard system architecture employed provided a framework for distributed cooperative problem solving, for the application of simplifying domain-specific modeling assumptions, and for integrating the various software modules that are involved in the entire finite element modeling and analysis process. These methodologies were implemented in a prototype computational tool calledIMCMA theIntelligentMultichipModuleAnalyzer. An example illustrates howIMCMA automates finite element thermal analysis of small integrated circuit features in multichip modules through a two-step finite element submodeling process.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1007/BF01200047
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