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  • 1
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    Unknown
    In:  CASI
    Publication Date: 2018-06-06
    Description: The purpose of this paper is to provide an overview of the Actel field programmable gate array (FPGA) issues and investigations to date, provide information to GSFC parts engineers on the risks associated with the use of these parts in flight, provide procurement options for their respective projects, and provide general guidance for use of these devices if no other acceptable options exist.
    Keywords: Electronics and Electrical Engineering
    Format: application/pdf
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  • 2
    Publication Date: 2018-08-10
    Description: This report documents the current status of CompactPCI(Registered TradeMark) connectors in GSFC spaceflight applications. To the extent the information is known, this report summarizes to what component quality level each NASA contractor (referred to as OEM in this report) procured the parts, and what board level and system level testing was performed. The report also provides the current status of the reliability assessment for each GSFC project based on the results of testing and FMEA (Failure Mode Effects Analysis). This report addresses how the CompactPCI(Registered TradeMark) connectors came into existence, and how these became the connector style chosen by many designers of space flight hardware. It identifies the design philosophy and the lack of robustness which has led to several known failure modes. These failure modes include fretting of connector pins during vibration, shock and thermal cycling, exposure of underplating, and increased resistance, including brief excursions to very high resistance. Each of these are signs of aging, which becomes an increasing concern for long duration orbiting space flight applications. This report addresses the mitigation strategy to replace CompactPCI(Registered TradeMark) connectors with space qualified Hypertronics 2mm cPCI connectors. The Hypertronics 2mm cPCI connectors are pin-to-pin compatible with the CompactPCI(Registered TradeMark) connectors and meet all of the same technical requirements, except the ability to hot mate, and to mate directly with a CompactPCI of the opposite gender. A detailed comparison of the CompactPCI(Registered TradeMark) connector and the Hypertronics 2mm cPCI connector is provided to describe the ruggedness of Hypertronics connector for space flight applications. Finally, this report makes recommendations for flight hardware for the future missions where the hardware is yet to be built, as well as for the hardware which has already been built with CompactPCI(Registered TradeMark) connectors.
    Keywords: Spacecraft Design, Testing and Performance
    Format: application/pdf
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  • 3
    Publication Date: 2019-07-10
    Description: Potential users of plastic encapsulated microcircuits (PEMs) need to be reminded that unlike the military system of producing robust high-reliability microcircuits that are designed to perform acceptably in a variety of harsh environments, PEMs are primarily designed for use in benign environments where equipment is easily accessed for repair or replacement. The methods of analysis applied to military products to demonstrate high reliability cannot always be applied to PEMs. This makes it difficult for users to characterize PEMs for two reasons: 1. Due to the major differences in design and construction, the standard test practices used to ensure that military devices are robust and have high reliability often cannot be applied to PEMs that have a smaller operating temperature range and are typically more frail and susceptible to moisture absorption. In contrast, high-reliability military microcircuits usually utilize large, robust, high-temperature packages that are hermetically sealed. 2. Unlike the military high-reliability system, users of PEMs have little visibility into commercial manufacturers proprietary design, materials, die traceability, and production processes and procedures. There is no central authority that monitors PEM commercial product for quality, and there are no controls in place that can be imposed across all commercial manufacturers to provide confidence to high-reliability users that a common acceptable level of quality exists for all PEMs manufacturers. Consequently, there is no guaranteed control over the type of reliability that is built into commercial product, and there is no guarantee that different lots from the same manufacturer are equally acceptable. And regarding application, there is no guarantee that commercial products intended for use in benign environments will provide acceptable performance and reliability in harsh space environments. The qualification and screening processes contained in this document are intended to detect poor-quality lots and screen out early random failures from use in space flight hardware. However, since it cannot be guaranteed that quality was designed and built into PEMs that are appropriate for space applications, users cannot screen in quality that may not exist. It must be understood that due to the variety of materials, processes, and technologies used to design and produce PEMs, this test process may not accelerate and detect all failure mechanisms. While the tests herein will increase user confidence that PEMs with otherwise unknown reliability can be used in space environments, such testing may not guarantee the same level of reliability offered by military microcircuits. PEMs should only be used where due to performance needs there are no alternatives in the military high-reliability market, and projects are willing to accept higher risk.
    Keywords: Electronics and Electrical Engineering
    Type: NASA/TP-2003-212244
    Format: application/pdf
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  • 4
    Publication Date: 2019-07-13
    Description: This paper reports the results of low dose rate (0.01-0.18 rads(Si)/sec) total ionizing dose (TID) tests performed on several types of high performance converters. The parts used in this evaluation represented devices such as a high speed flash converter, a 16-bit ADC and a voltage-to-frequency converter.
    Keywords: Electronics and Electrical Engineering
    Type: Radiation Effects Data Workshop; Jul 20, 1998 - Jul 24, 1998; Newport Beach, CA; United States
    Format: application/pdf
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  • 5
    facet.materialart.
    Unknown
    In:  CASI
    Publication Date: 2019-07-13
    Description: No abstract available
    Keywords: Electronics and Electrical Engineering
    Type: GSFC-E-DAA-TN24448 , NASA Electronic Parts and Packaging Program, Electronics Technology Workshop (NEPP-ETW); Jun 23, 2015 - Jun 26, 2015; Greenbelt, MD; United States
    Format: application/pdf
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