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  • 1
    Electronic Resource
    Electronic Resource
    Springer
    Wood science and technology 15 (1981), S. 125-144 
    ISSN: 1432-5225
    Source: Springer Online Journal Archives 1860-2000
    Topics: Agriculture, Forestry, Horticulture, Fishery, Domestic Science, Nutrition , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Summary The effect of moisture and level of stressing on the rate of creep and time to failure is studied for UF and MUF bonded particleboard. Response curves were fitted to a 4-element rheological model with a high degree of accuracy for four levels of stressing and for three levels of relative humidity at 20°C. Values of relative creep increased with time and also with increased levels of stress and r.h. The ratio of stress to deflection — presented either as the creep modulus or as isochronous curves — decreased rapidly with time. Particleboard is demonstrated to exhibit non-linear viscoelastic properties, particularly at the higher levels of stress. Deflection was increased and time to failure decreased when r.h. was raised from 65 to 90 per cent, but no significant statistical change was noted between 30 and 65 per cent r.h. Increased levels of stress caused a decrease in both deflection and time to failure. Greater deflection at failure and longer time to failure were recorded for MUF board, but for the UF board the 90 per cent r.h. had a more pronounced effect in increasing deflection and decreasing the time to failure. Predictions are made on the long-term stress loadings for different humidity conditions.
    Type of Medium: Electronic Resource
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  • 2
    Electronic Resource
    Electronic Resource
    Springer
    Wood science and technology 18 (1984), S. 205-224 
    ISSN: 1432-5225
    Source: Springer Online Journal Archives 1860-2000
    Topics: Agriculture, Forestry, Horticulture, Fishery, Domestic Science, Nutrition , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Summary Samples of five chipboards, one waferboard, one plywood, one fibre building board and Scots pine timber were loaded in four point bending at a stress equivalent to 60 per cent of the short term failing stress under five combinations of temperature and relative humidity for a period of six months, or until prior failure. Irrespective of whether creep behaviour was assessed in terms of total deflection, viscous component of deflection, relative creep, creep modulus, or deflection at, or time to failure, significant differences were obtained with variations both in temperature and relative humidity. The effect of temperature, at fixed humidity, was slightly greater between 20°C and 30°C than between 10°C and 20°C, while the effect of humidity was appreciably greater between 65% and 90% rh than between 30% and 65% rh. Fitting of hyperbolic curves to the data permitted the prediction of creep behaviour with a good degree of fit at any combination of temperature and humidity within the experimental range. Differences in response to environmental conditions existed among some of the boards. Thus the ranking order of the materials was slightly different under variable humidity than it was under variable temperature. It was possible to describe these differences in terms of the variation that occurred among the materials in the relative proportion of the elastic, viscoelastic and viscous components of deflection.
    Type of Medium: Electronic Resource
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  • 3
    Electronic Resource
    Electronic Resource
    Springer
    Wood science and technology 19 (1985), S. 83-91 
    ISSN: 1432-5225
    Source: Springer Online Journal Archives 1860-2000
    Topics: Agriculture, Forestry, Horticulture, Fishery, Domestic Science, Nutrition , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Summary Although previous papers in this series have shown that a 4-element rheological model can provide a very good representation of the creep deflection of chipboard in bending, a new set of long-term data shows that it has certain limitations as a model for predicting deflection up to 31/2 years. It was deduced in a earlier paper (Pierce et al. 1979) that the linear viscous flow component was likely to predict higher than actual deflections over a long period. This paper shows that view to be correct, and puts forward a modified 4-element model in which the viscous component is non-linear with respect to time. The resulting 5-parameter model is shown to be superior to the 4-parameter model for long-term predictions of creep deflection particularly at the lower stress levels, although it appears that the viscoelastic and viscous components of deflection are not as realistic as in the 4-parameter representation.
    Type of Medium: Electronic Resource
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  • 4
    Electronic Resource
    Electronic Resource
    Springer
    Wood science and technology 13 (1979), S. 265-282 
    ISSN: 1432-5225
    Source: Springer Online Journal Archives 1860-2000
    Topics: Agriculture, Forestry, Horticulture, Fishery, Domestic Science, Nutrition , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Summary Previous linear and curvilinear regression models for predicting the creep deflection of timber and timber products have failed to provide an adequately good fit. However, this paper shows that the 4-element (and to a lesser degree the 3-element) rheological model provides an extremely good fit to chipboard creep data. A set of experiments has been carried out on the creep behaviour of five commercially-available types of chipboard under 3-point sustained loading at constant temperature and humidity. This range of board types encompassed three types of glue — UF, MF/UF and Pf- and was loaded at two stress levels-30% and 60% of the short term ultimate stress. The lifetime of these specimens ranged from 25 days to over 31/2 years until either failure occurred or the load was removed. Creep curves based on 3- and 4-element rheological models have been fitted to the data from each specimen using an iterative least squares computer program which we developed. The validity of the two models is discussed, together with studies on the comparative behaviour of different board types and the use of the models as predictive tools.
    Type of Medium: Electronic Resource
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  • 5
    Electronic Resource
    Electronic Resource
    Springer
    Wood science and technology 20 (1986), S. 281-292 
    ISSN: 1432-5225
    Source: Springer Online Journal Archives 1860-2000
    Topics: Agriculture, Forestry, Horticulture, Fishery, Domestic Science, Nutrition , Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Summary A considerable amount of data has been collected over the past few years on the rupture life of particleboard. This information is particularly valuable at the present time because there is increasing interest in the use of particleboard as a structural material. This paper presents a conventional analysis of the time to failure of three commercially available brands of particleboard at 20°C and at three fixed levels of relative humidity. A linear relationship is assumed between the logarithm of time to failure and stress level, and an improvement is made in the usual method of analysis by including censored specimens. The regression lines are projected forward to give estimates of the stress levels that can be sustained for a particular design life. It is found that the regression lines for 30 per cent and 65 per cent rh may be combined, but the specimens at 90 per cent rh are significantly lower in strength at any given time. One of the MUF bonded boards performs significantly better than a second MUF board over the long term, and this gives added weight to the view that there are other factors in the make-up and production of the board that are at least as important as the resin type itself.
    Type of Medium: Electronic Resource
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  • 6
    Electronic Resource
    Electronic Resource
    Springer
    Journal of materials science 12 (1977), S. 1955-1960 
    ISSN: 1573-4803
    Source: Springer Online Journal Archives 1860-2000
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Notes: Abstract 3- and 4-element spring and dashpot models have frequently been applied to the behaviour of some visco-elastic materials, although somewhat less frequently to wood and wood-based sheet materials which are themselves visco-elastic. However there exists a need to develop a good analytical procedure for fitting the non-linear response curves corresponding to these models to experimental data. This paper describes such a method and applies it to the data from a creep experiment on UF chipboard bending specimens under sustained three-point loading. The computer program written for the solution process illustrates the response curves on a graph plot.
    Type of Medium: Electronic Resource
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  • 7
    Publication Date: 1973-02-05
    Print ISSN: 0031-9007
    Electronic ISSN: 1079-7114
    Topics: Physics
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  • 8
    Publication Date: 1989-04-01
    Print ISSN: 0163-1829
    Electronic ISSN: 1095-3795
    Topics: Physics
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  • 9
  • 10
    Publication Date: 1959-05-01
    Print ISSN: 0031-899X
    Electronic ISSN: 1536-6065
    Topics: Physics
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