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  • 1
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    The inert gas effect on the rate of evaporation of zinc and cadmium (1980)
    Springer
    Details
    Publication Date: 1980-12-01
    Print ISSN: 1073-5623
    Electronic ISSN: 1543-1940
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Published by Springer
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  • 2
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    A microscopy study of lead sinter (1974)
    Springer
    Details
    Publication Date: 1974-02-01
    Print ISSN: 1073-5623
    Electronic ISSN: 1543-1940
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Published by Springer
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  • 3
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    Control Techniques for Industrial Electrodeposition from Aqueous Solutions (1985)
    Springer
    Details
    Publication Date: 1985-01-01
    Print ISSN: 1047-4838
    Electronic ISSN: 1543-1851
    Topics: Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
    Published by Springer
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  • 4
    Electronic Resource
    Electronic Resource
    Effect of gas sparging on mass transfer in zinc electrolytes (1992)
    Springer
    Journal of applied electrochemistry 22 (1992), S. 596-605 
    Details
    ISSN: 1572-8838
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Electrical Engineering, Measurement and Control Technology
    Notes: Abstract The effect of sparging on mass transfer is reported for zinc electrolytes containing antimony and antimony-free electrolytes. Comparative results with non-sparged electrolytes show, an enhancement in mass transfer. In the sparged electrolyte, the mass transfer coefficients,K Zn, increase with increasing current density, antimony additions, and sulphuric acid concentration. The deposition morphology is consistent with the mass transfer results. A relationship between the mass transfer coefficients for sparged and non-sparged systems is obtained. The relationship correlates satisfactorily with the data and provides a quantitative method for determining the degree of enhancement in mass transfer coefficients due to sparging. The correlation which best represents the mass transfer data for sparged zinc electrolytes is $$Sh = 105(ReSc)^{0.23} $$ whereSh, Re, andSc are the Sherwood, Reynolds, and Schmidt numbers, respectively. The correlation represents the case where sparging is applied to a gas evolving electrode, hydrogen in this case.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01092607
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  • 5
    Electronic Resource
    Electronic Resource
    The degradation of aluminium cathodes by fluoride ion during zinc electrowinning (1992)
    Springer
    Journal of applied electrochemistry 22 (1992), S. 606-612 
    Details
    ISSN: 1572-8838
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Electrical Engineering, Measurement and Control Technology
    Notes: Abstract The influence of fluoride ions on aluminium cathode surface degradation during zinc electrowinning has been studied. Electrolyte with a composition similar to that employed in plant operations has been used. A direct correlation is shown between the electrolyte fluoride content and the number of deposition cycles possible before zinc removal becomes difficult. The role of initial nucleation and starting electrode morphology is discussed in terms of the degree of adherence observed. Electrochemical tests have also been made on the electrodes at various stages of the process in an attempt to gain a better fundamental understanding of the mechanisms responsible for the adherence. The results indicate that the severity, of the adherence is generally determined by the amount of residual zinc remaining on the surface after stripping and the fluoride content of the solution during plating. The contribution of physical surface condition alone seems to be less significant than the chemical conditions imposed during deposition.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01092608
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  • 6
    Electronic Resource
    Electronic Resource
    Electrochemical evaluation of copper deposition with gas sparging (1990)
    Springer
    Journal of applied electrochemistry 20 (1990), S. 327-334 
    Details
    ISSN: 1572-8838
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Electrical Engineering, Measurement and Control Technology
    Notes: Abstract The influence of gas sparging during copper electrolysis was studied using standard electrochemical techniques. The polarization behaviour of acid copper electrolytes was determined in the presence and absence of gas sparging on vertical electrodes. Tracer ion techniques were employed to determine the effect of gas sparging and forced circulation of the electrolyte on the mass transfer characteristics of the system. In addition to the potentiodynamic scans, 3-h copper deposits were produced for morphology and orientation studies. The effect of current density and temperature on deposition were also studied. The polarization experiments have shown that a mass transfer component becomes evident at about 40% of the limiting current density at which point the deposit becomes noticeably rougher.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01033612
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  • 7
    Electronic Resource
    Electronic Resource
    Electrodeposition of copper on thermally oxidized 316 L stainless steel substrates (1998)
    Springer
    Journal of applied electrochemistry 28 (1998), S. 461-469 
    Details
    ISSN: 1572-8838
    Keywords: copper deposition ; electrocrystallization ; thermally treated stainless steel
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Electrical Engineering, Measurement and Control Technology
    Notes: Abstract The effect of thermal oxidation of 316 L stainless steel cathode blanks used in copper electrodeposition was studied. Current and potential step experiments were performed to evaluate electrochemical changes caused by the oxidation treatments. SEM and AES were used to characterize the stainless steel substrates and the deposited copper films. Particular emphasis was given to the initial stages of copper nucleation and growth. The copper electrocrystallization process was strongly influenced by the temperature employed in oxidizing the stainless steel. Dense, uniform and fine copper nuclei were obtained on the stainless steel substrate oxidized in air at 200°C and 300°C for 3h. The copper nucleation density and uniformity decreased considerably on substrates treated at 500°C and 600°C. Attempts were made to identify changes in the mechanism of copper nucleation on the various oxidized stainless steel substrates using models developed by Thirsk and Harrison.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1023/A:1003209009910
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  • 8
    Electronic Resource
    Electronic Resource
    On the effects of antimony and glue on zinc electrocrystallization behaviour (1976)
    Springer
    Journal of applied electrochemistry 6 (1976), S. 1-7 
    Details
    ISSN: 1572-8838
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Electrical Engineering, Measurement and Control Technology
    Notes: Abstract An investigation has been made to determine the effects that additions of glue and antimony have on the electrowinning of zinc from acid sulphate solutions. In particular, the zinc crystal growth and cathode current efficiencies were studied in an attempt to establish a correlation between morphology and the nature of the additives. Operating conditions of 55 A ft−2#x002A; and 35°C were used for most of the experiments with electrolyte concentrations of approximately 55 gl−1 zinc and 150 gl−1 H2SO4. Additional runs were made at 40,75 and 100 Aft−2 at 30,40 and 50°C in order to verify certain trends. Primarily by means of scanning electron microscopy (SEM) techniques, it was possible to categorize deposit morphologies according to the type and concentration of the additives. The general effect of antimony was to refine the grain size and cause the basal plane platelets to lie parallel to the substrate. Glue also caused some refinement, but caused the platelets to become aligned perpendicular to the substrate. Level deposits were obtained in the latter case, which would effectively prevent dendritic growths. A relationship between the relative amounts of glue and antimony in solution and the current efficiency was also obtained.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF01058863
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  • 9
    Electronic Resource
    Electronic Resource
    Anodic dissolution of galena concentrate in perchloric acid (1978)
    Springer
    Journal of applied electrochemistry 8 (1978), S. 25-32 
    Details
    ISSN: 1572-8838
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Electrical Engineering, Measurement and Control Technology
    Notes: Abstract A basic study has been made on the anodic dissolution of lead sulphide ore (galena) in perchloric acid. The electrodes used in the research were fabricated by melting and casting the ore in a suitable mould. The phases which were present in sufficient quantities to be detected by X-ray diffraction were PbS and ZnS. Coulombic efficiencies were determined at 40° C at various levels of pH and current density, and were in the range of 90% for most of the tests. Transient studies revealed a non-uniform surface attack and that the dissolution reaction was irreversible, as indicated by the absence of cathodic currents, in the vicinity of the rest potential. Steady-state studies showed the reaction to be activation controlled and that the rate-determining step was a chemical reaction following the first electron transfer.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF00615390
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  • 10
    Electronic Resource
    Electronic Resource
    The effect of antimony, chloride ion, and glue on copper electrorefining (1978)
    Springer
    Journal of applied electrochemistry 8 (1978), S. 109-119 
    Details
    ISSN: 1572-8838
    Source: Springer Online Journal Archives 1860-2000
    Topics: Chemistry and Pharmacology , Electrical Engineering, Measurement and Control Technology
    Notes: Abstract A study has been made to determine the effect of antimony, chloride ion, and glue on copper electrorefining. All deposits were made at a temperature of 65° C on a titanium cathode. Current densities of 398 A m−2 and 133 A m−2 were used. The deposits were analyzed by scanning electron microscopy (SEM) and X-ray diffraction (XRD) to determine morphology and crystal orientation. Atomic absorption (AA) and Auger spectroscopy (AES) were used to study the chemical composition of the deposits and a simple bend test was used to determine structural integrity. It was found that when the antimony concentration in the electrolyte exceeded 300 ppm, brittle deposits were produced containing considerable amounts of antimony. Very small amounts of chloride ion (1.5 ppm or above) decreased the codeposition of antimony greatly and produced ductile deposits. However, at a chloride ion level of 15 ppm or above, the back side of the deposit had a very rough, powdery appearance. The effect of glue was to counteract this and to produce a mirror-like finish on the deposit back.
    Type of Medium: Electronic Resource
    URL: http://dx.doi.org/10.1007/BF00617669
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