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  • 1
    Publication Date: 2005-03-28
    Description: Research aimed at faster, more cost effective parallel machines and algorithms for improving designer productivity with finite element computations is discussed. A set of 8 boards, containing 4 nearest neighbor connected arrays of commercially available floating point chips and substantial memory, are inserted into a commercially available machine. One-tenth Mflop (64 bit operation) processors provide an 89% efficiency when solving the equations arising in a finite element problem for a single variable regular grid of size 40 by 40 by 40. This is approximately 15 to 20 times faster than a much more expensive machine such as a VAX 11/780 used in double precision. The efficiency falls off as faster or more processors are envisaged because communication times become dominant. A novel successive overrelaxation algorithm which uses cyclic reduction in order to permit data transfer and computation to overlap in time is proposed.
    Keywords: STRUCTURAL MECHANICS
    Type: NASA. Langley Research Center Res. in Struct. and Dyn., 1984; p 15-29
    Format: text
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  • 2
    Electronic Resource
    Electronic Resource
    Chichester [u.a.] : Wiley-Blackwell
    International Journal for Numerical Methods in Engineering 11 (1977), S. 11-25 
    ISSN: 0029-5981
    Keywords: Engineering ; Engineering General
    Source: Wiley InterScience Backfile Collection 1832-2000
    Topics: Mathematics , Technology
    Notes: A finite element method is developed for investigating the propagation of high frequency electromagnetic waves along closed or open (surface) waveguides containing dissipative materials and having a cross section of arbitrary shape. The complex propagation constants and associated complex electromagnetic fields are determined as a function of frequency for possible modes of propagation. The method is verified by applying it to structures of simple shape for which analytical results may be calculated for comparison. Waveguides considered include a waveguide filled with dissipative material, a dissipative dielectric rod, a dielectric coated wire and a conducting wire.
    Additional Material: 10 Ill.
    Type of Medium: Electronic Resource
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