ISSN:
1572-9605
Keywords:
electrostatic bonding
;
films
;
high-T c
Source:
Springer Online Journal Archives 1860-2000
Topics:
Electrical Engineering, Measurement and Control Technology
,
Physics
Notes:
Abstract Complete integration of high-T c thin-film superconducting technology with other electronic technologies requires hybrid structures with both technologies on the same substrate. This is difficult to do with direct growth of the superconductor on certain substrates (GaAs, InP) because of the high temperatures required for formation of the superconductor. A method is proposed to circumvent this problem by using electrostatic forces and appropriate thin-film materials to bond superconducting films to any substrate at 300°C. The same principle can be applied to the bonding of other devices on other substrates.
Type of Medium:
Electronic Resource
URL:
http://dx.doi.org/10.1007/BF00617718
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